AMD Radeon PRO W7700 vs Intel Arc A770 Full Specs
3,072 Shaders 2.6GHz | 4,096 Shaders 2.4GHz |
16GB GDDR6576GB/s | 8GB GDDR6512GB/s |
·· 31.95 TFLOPS | ·· 19.66 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 190W | TDP 225W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 127.8 TOPSINT4 Tensor | Peak OPS 629.1 TOPSINT4 Tensor |
Tensor FP16-16 31.95 TFLOPSTensor FP16-32 31.95 TFLOPS | Tensor FP16-16 -Tensor FP16-32 157.3 TFLOPS |
BF16 63.9 TFLOPSTensor BF16 31.95 TFLOPS | BF16 -Tensor BF16 157.3 TFLOPS |
FP32 31.95 TFLOPS | FP32 19.66 TFLOPS |
FP64 998.4 GFLOPS | FP64 4.92 TFLOPS |
Tensor INT4 127.8 TOPS | Tensor INT4 629.1 TOPS |
Tensor INT8 31.95 TOPS | Tensor INT8 314.6 TOPS |
Pixel Rate 249.6 GPixel/s | Pixel Rate 307.2 GPixel/s |
Texture Rate 499.2 GTexel/s | Texture Rate 614.4 GTexel/s |
Shaders 3,072 Shaders | Shaders 4,096 Shaders |
TMUs 192 TMUs | TMUs 256 TMUs |
ROPs 96 ROPs | ROPs 128 ROPs |
Tensor Cores 96 T-Cores | Tensor Cores 512 T-Cores |
RT Cores 48 RT-Cores | RT Cores 32 RT-Cores |
CUs 48 CUs | EUs 512 EUs |
Base Clock 1.9GHz | Base Clock 2.1GHz |
Boost Clock 2.6GHz | Boost Clock 2.4GHz |
L2 Cache 6.1MB shared | L2 Cache 8.2MB shared |
L3 Cache 64MB shared | L3 Cache - |
L3 Bandwidth 2.33TB/s | L3 Bandwidth - |
16GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 16GT/s |
Memory Bandwidth 576GB/s | Memory Bandwidth 512GB/s |
ECC No | ECC No |
TDP 190W | TDP 225W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 3x DisplayPort 2.0 |
- | 1x HDMI 2.1 |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 241 mm (9.49")Depth 40 mm (1.57") | Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Wheat Nas | Codename Xe HPG |
Chip Variant Navi 32 | Chip Variant DG2-512 |
Market Segment Workstation | Market Segment Desktop |
Release Date Nov 13, 2023 | Release Date Oct 14, 2022 |
Foundry TSMC | Foundry TSMC |
Other Foundries TSMCMCD | Other Foundries - |
Fabrication Node N5 N6MCD | Fabrication Node N6 - |
Die Size 200mm² 150mm²MCD | Die Size 406mm² - |
Transistor Count 28.1 Billion 8.2 BillionMCD | Transistor Count 21.7 Billion - |
Transistor Density 140.5 MTr/mm² 54.67 MTr/mm²MCD | Transistor Density 53.45 MTr/mm² - |
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