AMD Radeon PRO W7700 vs NVIDIA GeForce RTX 3070 Laptop 90W Full Specs
3,072 Shaders 2.6GHz | 5,120 Shaders 1.41GHz |
16GB GDDR6576GB/s | 8GB GDDR6384GB/s |
·· 31.95 TFLOPS | ·· 14.44 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 190W | TDP 90W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 127.8 TOPSINT4 Tensor | Peak OPS 462 TOPSINT4 Tensor Sparse |
Tensor FP16-16 31.95 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 31.95 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 57.75 TFLOPSFP16-16 Tensor Sparse 115.5 TFLOPSTensor FP16-32 28.88 TFLOPSFP16-32 Tensor Sparse 57.75 TFLOPS |
BF16 63.9 TFLOPSTensor BF16 31.95 TFLOPSBF16 Tensor Sparse - | BF16 14.44 TFLOPSTensor BF16 28.88 TFLOPSBF16 Tensor Sparse 57.75 TFLOPS |
Tensor TF32 - | Tensor TF32 14.44 TFLOPS |
FP32 31.95 TFLOPS | FP32 14.44 TFLOPS |
FP64 998.4 GFLOPS | FP64 225.6 GFLOPS |
Tensor INT4 127.8 TOPS | Tensor INT4 231 TOPS |
Tensor INT8 31.95 TOPS | Tensor INT8 115.5 TOPS |
Ray - | Ray 21.78 TOPS |
Pixel Rate 249.6 GPixel/s | Pixel Rate 112.8 GPixel/s |
Texture Rate 499.2 GTexel/s | Texture Rate 225.6 GTexel/s |
Shaders 3,072 Shaders | Shaders 5,120 Shaders |
TMUs 192 TMUs | TMUs 160 TMUs |
ROPs 96 ROPs | ROPs 80 ROPs |
Tensor Cores 96 T-Cores | Tensor Cores 160 T-Cores |
RT Cores 48 RT-Cores | RT Cores 40 RT-Cores |
CUs 48 CUs | SMs 40 SMs |
Base Clock 1.9GHz | Base Clock 930MHz |
Boost Clock 2.6GHz | Boost Clock 1.41GHz |
L2 Cache 6.1MB shared | L2 Cache 4.1MB shared |
L3 Cache 64MB shared | L3 Cache - |
L3 Bandwidth 2.33TB/s | L3 Bandwidth - |
16GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 12GT/s |
Memory Bandwidth 576GB/s | Memory Bandwidth 384GB/s |
TDP 190W | TDP 90W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
4x DisplayPort 2.1 | - |
Encoder Model VCN 4.0 | Encoder Model NVENC 7 |
Decoder Model VCN 4.0 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 111 mm (4.37")Width 241 mm (9.49")Depth 40 mm (1.57") | - |
Cooling Blower 1x Fan | Cooling Open-Air - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Wheat Nas | Codename NV174 |
Chip Variant Navi 32 | Chip Variant GA104-150-A1 |
Market Segment Workstation | Market Segment Laptop |
Release Date Nov 13, 2023 | Release Date Jan 12, 2021 |
Foundry TSMC | Foundry Samsung |
Other Foundries TSMCMCD | Other Foundries - |
Fabrication Node N5 N6MCD | Fabrication Node 8N - |
Die Size 200mm² 150mm²MCD | Die Size 393mm² - |
Transistor Count 28.1 Billion 8.2 BillionMCD | Transistor Count 17.4 Billion - |
Transistor Density 140.5 MTr/mm² 54.67 MTr/mm²MCD | Transistor Density 44.33 MTr/mm² - |
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