GPUs

AMD Radeon PRO W7800 vs Apple Radeon Pro Vega II Full Specs

4,480 Shaders
2.52GHz
4,096 Shaders
1.72GHz
32GB GDDR6576GB/s
32GB HBM21.02TB/s
··
45.25 TFLOPS
··
14.09 TFLOPS
Form Factor
PCIe Card
Form Factor
MPX
TDP
260W
TDP
300W
Power Connectors
2x 8-Pin
Power Connectors
-

Radeon PRO W7800Radeon PRO W7800181 TOPSINT4 Tensor
x6.42
Radeon Pro Vega IIRadeon Pro Vega II28.18 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
181 TOPSINT4 Tensor
Peak OPS
28.18 TFLOPSFP16
Tensor FP16-16
45.25 TFLOPS
Tensor FP16-32
45.25 TFLOPS
-
BF16
90.5 TFLOPS
Tensor BF16
45.25 TFLOPS
-
FP32
45.25 TFLOPS
FP32
14.09 TFLOPS
FP64
1.41 TFLOPS
FP64
3.52 TFLOPS
Tensor INT4
181 TOPS
Tensor INT4
-
Tensor INT8
45.25 TOPS
-
Pixel Rate
323.2 GPixel/s
Pixel Rate
110.1 GPixel/s
Texture Rate
707 GTexel/s
Texture Rate
440.3 GTexel/s

Shaders
4,480 Shaders
Shaders
4,096 Shaders
TMUs
280 TMUs
TMUs
256 TMUs
ROPs
128 ROPs
ROPs
64 ROPs
Tensor Cores
140 T-Cores
Tensor Cores
-
RT Cores
70 RT-Cores
RT Cores
-
CUs
70 CUs
CUs
64 CUs

Boost Clock
2.52GHz
Boost Clock
1.72GHz

L2 Cache
6.1MB shared
L2 Cache
4.1MB shared
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.33TB/s
L3 Bandwidth
-

32GB GDDR6
32GB HBM2
Memory Bus
256-bit
Memory Bus
4096-bit
Memory Speed
18GT/s
Memory Speed
2GT/s
Memory Bandwidth
576GB/s
Memory Bandwidth
1.02TB/s
ECC
No
ECC
No

TDP
260W
TDP
300W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.2

3x DisplayPort 2.1
-
1x Mini DisplayPort 2.1
-
-
1x HDMI 2.0
-
4x Thunderbolt 3

Encoder Model
VCN 4.0
Encoder Model
VCE 4.1

Decoder Model
VCN 4.0
Decoder Model
UVD 7.2

Form Factor
PCIe Card
Form Factor
MPX
PCIe
2-Slots
PCIe
4-Slots
Height
110 mm (4.33")
Width
280 mm (11.02")
Depth
40 mm (1.57")
-
Cooling
Blower
1x Fan
Cooling
Passive
-
Power Connectors
2x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
Vega Pro branding
Codename
Plum Bonito
Codename
Moonshot
Chip Variant
Navi 31 XL
Chip Variant
Vega 20 XT
Market Segment
Workstation
Market Segment
Workstation
Release Date
Apr 13, 2023
Release Date
Dec 1, 2019

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
N7
-
Die Size
304mm²
225mm²MCD
Die Size
331mm²
-
Transistor Count
45.4 Billion
12.3 BillionMCD
Transistor Count
13.2 Billion
-
Transistor Density
149.2 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
39.97 MTr/mm²
-

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