AMD Radeon PRO WX 3100 vs AMD Radeon RX 7400 Full Specs
512 Shaders 1.22GHz | 1,792 Shaders 1.1GHz |
4GB GDDR596GB/s | 8GB GDDR6172.8GB/s |
·· 1.25 TFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 50W | TDP 55W |
Power Connectors - | Power Connectors 1x 8-Pin |
Radeon PRO WX 31001.25 TFLOPSFP16
Radeon RX 740031.54 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 1.25 TFLOPSFP16 | Peak OPS 31.54 TOPSINT4 Tensor |
- | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
- | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 1.25 TFLOPS | FP32 7.88 TFLOPS |
FP64 78.02 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 - | Tensor INT4 31.54 TOPS |
- | Tensor INT8 7.88 TOPS |
Pixel Rate 19.5 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 39 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 512 Shaders | Shaders 1,792 Shaders |
TMUs 32 TMUs | TMUs 112 TMUs |
ROPs 16 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 8 CUs | CUs 28 CUs |
Base Clock 925MHz | Base Clock 1GHz |
Boost Clock 1.22GHz | Boost Clock 1.1GHz |
L2 Cache 512KB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.16TB/s |
4GB GDDR5 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 96GB/s | Memory Bandwidth 172.8GB/s |
ECC No | ECC No |
TDP 50W | TDP 55W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
1x DisplayPort 1.4 | - |
2x Mini DisplayPort 1.4 | - |
- | 1x HDMI 2.1 |
Encoder Model VCE 3.4 | Encoder Model VCN 4.0 |
Decoder Model UVD 6.3 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 168 mm (6.61")Depth 20 mm (0.79") | Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Lexa | Codename Hotpink Bonefish |
Chip Variant Polaris 12 XL | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Desktop |
Release Date Jun 1, 2017 | Release Date Aug 8, 2025 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node N6 |
Die Size 103mm² | Die Size 204mm² |
Transistor Count 2.2 Billion | Transistor Count 13.3 Billion |
Transistor Density 21.36 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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