GPUs

AMD Radeon Pro WX 3100M vs NVIDIA GeForce RTX 2080 Super Full Specs

512 Shaders
1.22GHz
3,072 Shaders
1.81GHz
4GB GDDR596GB/s
8GB GDDR6496.6GB/s
··
1.25 TFLOPS
··
11.15 TFLOPS
Form Factor
Soldered
Form Factor
PCIe Card
TDP
50W
TDP
250W
Power Connectors
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon Pro WX 3100MRadeon Pro WX 3100M1.25 TFLOPSFP16
x1
GeForce RTX 2080 SuperGeForce RTX 2080 Super356.8 TOPSINT4 Tensor
x285.87

Clock Speed
···
Clock Speed
···
Peak OPS
1.25 TFLOPSFP16
Peak OPS
356.8 TOPSINT4 Tensor
-
Tensor FP16-16
89.21 TFLOPS
Tensor FP16-32
44.61 TFLOPS
-
Tensor BF16
44.61 TFLOPS
Tensor TF32
-
Tensor TF32
44.61 TFLOPS
FP32
1.25 TFLOPS
FP32
11.15 TFLOPS
FP64
78.02 GFLOPS
FP64
348.5 GFLOPS
Tensor INT4
-
Tensor INT4
356.8 TOPS
-
Tensor INT8
178.4 TOPS
Ray
-
Ray
33.64 TOPS
Pixel Rate
19.5 GPixel/s
Pixel Rate
116.2 GPixel/s
Texture Rate
39 GTexel/s
Texture Rate
348.5 GTexel/s

Shaders
512 Shaders
Shaders
3,072 Shaders
TMUs
32 TMUs
TMUs
192 TMUs
ROPs
16 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
384 T-Cores
RT Cores
-
RT Cores
48 RT-Cores
CUs
8 CUs
SMs
48 SMs

Base Clock
925MHz
Base Clock
1.65GHz
Boost Clock
1.22GHz
Boost Clock
1.81GHz

L2 Cache
512KB shared
L2 Cache
4.1MB shared

4GB GDDR5
8GB GDDR6
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
6GT/s
Memory Speed
15.5GT/s
Memory Bandwidth
96GB/s
Memory Bandwidth
496.6GB/s

TDP
50W
TDP
250W
Max Temp
-
Max Temp
89°C Max

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
HDCP 2.2

-
3x DisplayPort 1.4
-
1x HDMI 2.0
-
1x USB-C

Encoder Model
VCE 3.4
Encoder Model
NVENC 7

Decoder Model
UVD 6.3
Decoder Model
NVDEC 4

Form Factor
Soldered
Form Factor
PCIe Card
PCIe
-
PCIe
2-Slots
-
Height
115.7 mm (4.55")
Width
266.7 mm (10.5")
Depth
35 mm (1.38")
Cooling
Open-Air
-
Cooling
Open-Air
2x Fans
Power Connectors
-
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2016 branding
Branding
GeForce RTX 2018 branding
Codename
Lexa
Codename
NV164
Chip Variant
Polaris 12 XL
Chip Variant
TU104-150-KC-A1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Mar 1, 2017
Release Date
Jul 23, 2019

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
12FFN
Die Size
103mm²
Die Size
545mm²
Transistor Count
2.2 Billion
Transistor Count
13.6 Billion
Transistor Density
21.36 MTr/mm²
Transistor Density
24.95 MTr/mm²

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