GPUs

AMD Radeon Pro WX 3200M vs NVIDIA GeForce RTX 2070 Super Full Specs

640 Shaders
1.29GHz
2,560 Shaders
1.77GHz
4GB GDDR564GB/s
8GB GDDR6448GB/s
··
1.66 TFLOPS
··
9.06 TFLOPS
Form Factor
Soldered
Form Factor
PCIe Card
TDP
65W
TDP
215W
Power Connectors
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon Pro WX 3200MRadeon Pro WX 3200M1.66 TFLOPSFP16
x1
GeForce RTX 2070 SuperGeForce RTX 2070 Super290 TOPSINT4 Tensor
x174.95

Clock Speed
···
Clock Speed
···
Peak OPS
1.66 TFLOPSFP16
Peak OPS
290 TOPSINT4 Tensor
-
Tensor FP16-16
72.5 TFLOPS
Tensor FP16-32
36.25 TFLOPS
-
Tensor BF16
36.25 TFLOPS
Tensor TF32
-
Tensor TF32
36.25 TFLOPS
FP32
1.66 TFLOPS
FP32
9.06 TFLOPS
FP64
103.6 GFLOPS
FP64
283.2 GFLOPS
Tensor INT4
-
Tensor INT4
290 TOPS
-
Tensor INT8
145 TOPS
Ray
-
Ray
27.34 TOPS
Pixel Rate
20.7 GPixel/s
Pixel Rate
113.3 GPixel/s
Texture Rate
41.4 GTexel/s
Texture Rate
283.2 GTexel/s

Shaders
640 Shaders
Shaders
2,560 Shaders
TMUs
32 TMUs
TMUs
160 TMUs
ROPs
16 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
320 T-Cores
RT Cores
-
RT Cores
40 RT-Cores
CUs
10 CUs
SMs
40 SMs

Base Clock
1.08GHz
Base Clock
1.6GHz
Boost Clock
1.29GHz
Boost Clock
1.77GHz

L2 Cache
512KB shared
L2 Cache
4.1MB shared

4GB GDDR5
8GB GDDR6
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
4GT/s
Memory Speed
14GT/s
Memory Bandwidth
64GB/s
Memory Bandwidth
448GB/s

TDP
65W
TDP
215W
Max Temp
-
Max Temp
88°C Max

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
HDCP 2.2

-
3x DisplayPort 1.4
-
1x HDMI 2.0
-
1x DVI-D Dual-Link
-
1x USB-C

Encoder Model
VCE 3.4
Encoder Model
NVENC 7

Decoder Model
UVD 6.3
Decoder Model
NVDEC 4

Form Factor
Soldered
Form Factor
PCIe Card
PCIe
-
PCIe
2-Slots
-
Height
115.7 mm (4.55")
Width
266.7 mm (10.5")
Depth
35 mm (1.38")
Cooling
Open-Air
-
Cooling
Open-Air
2x Fans
Power Connectors
-
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2016 branding
Branding
GeForce RTX 2018 branding
Codename
Lexa
Codename
NV164
Chip Variant
Polaris 23 XLM
Chip Variant
TU104-150-KC-A1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Mar 1, 2017
Release Date
Jul 9, 2019

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
12FFN
Die Size
103mm²
Die Size
545mm²
Transistor Count
2.2 Billion
Transistor Count
13.6 Billion
Transistor Density
21.36 MTr/mm²
Transistor Density
24.95 MTr/mm²

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