GPUs

AMD Radeon PRO WX 4100 vs NVIDIA GeForce RTX 3050 6GB Full Specs

1,024 Shaders
1.2GHz
2,304 Shaders
1.47GHz
4GB GDDR5112GB/s
6GB GDDR6168GB/s
··
2.46 TFLOPS
··
6.77 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
50W
TDP
70W

Radeon PRO WX 4100Radeon PRO WX 41002.46 TFLOPSFP16
x1
GeForce RTX 3050 6GBGeForce RTX 3050 6GB216.8 TOPSINT4 Tensor Sparse
x88.13

Clock Speed
···
Clock Speed
···
Peak OPS
2.46 TFLOPSFP16
Peak OPS
216.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.1 TFLOPS
FP16-16 Tensor Sparse
54.19 TFLOPS
Tensor FP16-32
13.55 TFLOPS
FP16-32 Tensor Sparse
27.1 TFLOPS
-
BF16
6.77 TFLOPS
Tensor BF16
13.55 TFLOPS
BF16 Tensor Sparse
27.1 TFLOPS
Tensor TF32
-
Tensor TF32
6.77 TFLOPS
FP32
2.46 TFLOPS
FP32
6.77 TFLOPS
FP64
153.7 GFLOPS
FP64
105.8 GFLOPS
Tensor INT4
-
Tensor INT4
108.4 TOPS
-
Tensor INT8
54.19 TOPS
Ray
-
Ray
10.22 TOPS
Pixel Rate
19.2 GPixel/s
Pixel Rate
47 GPixel/s
Texture Rate
76.9 GTexel/s
Texture Rate
105.8 GTexel/s

Shaders
1,024 Shaders
Shaders
2,304 Shaders
TMUs
64 TMUs
TMUs
72 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CUs
16 CUs
SMs
18 SMs

Base Clock
1.13GHz
Base Clock
1.04GHz
Boost Clock
1.2GHz
Boost Clock
1.47GHz

L2 Cache
1MB shared
L2 Cache
2MB shared

4GB GDDR5
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
7GT/s
Memory Speed
14GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
168GB/s
ECC
No
ECC
No

TDP
50W
TDP
70W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
4x Mini DisplayPort 1.4
-
-
1x HDMI 2.1

Encoder Model
VCE 3.4
Encoder Model
NVENC 7

Decoder Model
UVD 6.3
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1.9-Slots
Height
69 mm (2.72")
Width
168 mm (6.61")
Depth
20 mm (0.79")
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2016 branding
Branding
GeForce RTX 2018 branding
Codename
Baffin
Codename
NV177
Chip Variant
Polaris 11 XL
Chip Variant
GA107-140-A1
Market Segment
Workstation
Market Segment
Desktop
Release Date
Nov 10, 2016
Release Date
Feb 2, 2024

Foundry
GlobalFoundries
Foundry
Samsung
Fabrication Node
14LPP
Fabrication Node
8N
Die Size
123mm²
Die Size
200mm²
Transistor Count
3 Billion
Transistor Count
8.7 Billion
Transistor Density
24.39 MTr/mm²
Transistor Density
43.5 MTr/mm²

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