AMD Radeon Pro WX 4130 vs NVIDIA GeForce RTX 4070 Laptop 80W Full Specs
640 Shaders 1.05GHz | 4,608 Shaders 1.7GHz |
4GB GDDR596GB/s | 8GB GDDR6256GB/s |
·· 1.35 TFLOPS | ·· 15.62 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 50W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 1.35 TFLOPSFP16 | Peak OPS 499.9 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 125 TFLOPSFP8-16 Tensor Sparse 249.9 TFLOPSTensor FP8-32 62.48 TFLOPSFP8-32 Tensor Sparse 125 TFLOPS |
- | Tensor FP16-16 62.48 TFLOPSFP16-16 Tensor Sparse 125 TFLOPSTensor FP16-32 31.24 TFLOPSFP16-32 Tensor Sparse 62.48 TFLOPS |
- | BF16 15.62 TFLOPSTensor BF16 31.24 TFLOPSBF16 Tensor Sparse 62.48 TFLOPS |
Tensor TF32 - | Tensor TF32 15.62 TFLOPS |
FP32 1.35 TFLOPS | FP32 15.62 TFLOPS |
FP64 84.24 GFLOPS | FP64 244.1 GFLOPS |
Tensor INT4 - | Tensor INT4 249.9 TOPS |
- | Tensor INT8 125 TOPS |
Ray - | Ray 36.11 TOPS |
Pixel Rate 16.9 GPixel/s | Pixel Rate 81.4 GPixel/s |
Texture Rate 42.1 GTexel/s | Texture Rate 244.1 GTexel/s |
Shaders 640 Shaders | Shaders 4,608 Shaders |
TMUs 40 TMUs | TMUs 144 TMUs |
ROPs 16 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 144 T-Cores |
RT Cores - | RT Cores 36 RT-Cores |
CUs 10 CUs | SMs 36 SMs |
Base Clock 1GHz | Base Clock 1.4GHz |
Boost Clock 1.05GHz | Boost Clock 1.7GHz |
L2 Cache 1MB shared | L2 Cache 32MB shared |
4GB GDDR5 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6GT/s | Memory Speed 16GT/s |
Memory Bandwidth 96GB/s | Memory Bandwidth 256GB/s |
ECC No | ECC No |
TDP 50W | TDP 80W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
Encoder Model VCE 3.4 | Encoder Model NVENC 8 |
Codec AVC (H.264) HEVC (H.265) - | Codec AVC (H.264) HEVC (H.265) AV1 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - - AVC (H.264) HEVC (H.265) - | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Baffin | Codename NV186 |
Chip Variant Polaris 11 XL | Chip Variant AD106-350-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Mar 1, 2017 | Release Date Feb 22, 2023 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node 4N |
Die Size 123mm² | Die Size 188mm² |
Transistor Count 3 Billion | Transistor Count 22.9 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 121.8 MTr/mm² |

