AMD Radeon Pro WX 4170 vs EVGA GeForce RTX 3070 XC3 Ultra Full Specs
1,024 Shaders 1.2GHz | 5,888 Shaders 1.77GHz |
4GB GDDR596GB/s | 8GB GDDR6448GB/s |
·· 2.46 TFLOPS | ·· 20.84 TFLOPS |
Form Factor Soldered | Form Factor PCIe Card |
TDP 60W | TDP 220W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 2.46 TFLOPSFP16 | Peak OPS 667 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 83.37 TFLOPSFP16-16 Tensor Sparse 166.7 TFLOPSTensor FP16-32 41.69 TFLOPSFP16-32 Tensor Sparse 83.37 TFLOPS |
- | BF16 20.84 TFLOPSTensor BF16 41.69 TFLOPSBF16 Tensor Sparse 83.37 TFLOPS |
Tensor TF32 - | Tensor TF32 20.84 TFLOPS |
FP32 2.46 TFLOPS | FP32 20.84 TFLOPS |
FP64 153.7 GFLOPS | FP64 325.7 GFLOPS |
Tensor INT4 - | Tensor INT4 333.5 TOPS |
- | Tensor INT8 166.7 TOPS |
Ray - | Ray 31.44 TOPS |
Pixel Rate 19.2 GPixel/s | Pixel Rate 169.9 GPixel/s |
Texture Rate 76.9 GTexel/s | Texture Rate 325.7 GTexel/s |
Shaders 1,024 Shaders | Shaders 5,888 Shaders |
TMUs 64 TMUs | TMUs 184 TMUs |
ROPs 16 ROPs | ROPs 96 ROPs |
Tensor Cores - | Tensor Cores 184 T-Cores |
RT Cores - | RT Cores 46 RT-Cores |
CUs 16 CUs | SMs 46 SMs |
Base Clock 1GHz | Base Clock 1.5GHz |
Boost Clock 1.2GHz | Boost Clock 1.77GHz |
L2 Cache 1MB shared | L2 Cache 4.1MB shared |
4GB GDDR5 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 6GT/s | Memory Speed 14GT/s |
Memory Bandwidth 96GB/s | Memory Bandwidth 448GB/s |
TDP 60W | TDP 220W |
Max Temp - | Max Temp 93°C Max |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
Encoder Model VCE 3.4 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor PCIe Card |
PCIe - | PCIe 2.1-Slots |
- | Height 111.2 mm (4.38")Width 285.4 mm (11.24")Depth 43 mm (1.69") |
Cooling Open-Air - | Cooling Open-Air 3x Fans |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Baffin | Codename NV174 |
Chip Variant Polaris 11 XL | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Mar 1, 2017 | Release Date Oct 29, 2020 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 123mm² | Die Size 393mm² |
Transistor Count 3 Billion | Transistor Count 17.4 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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