AMD Radeon Pro WX 4170 vs NVIDIA Quadro RTX 6000 Full Specs
1,024 Shaders 1.2GHz | 4,608 Shaders 1.77GHz |
4GB GDDR596GB/s | 24GB GDDR6672GB/s |
·· 2.46 TFLOPS | ·· 16.31 TFLOPS |
Form Factor Soldered | Form Factor PCIe Card |
TDP 60W | TDP 260W |
Power Connectors - | Power Connectors 1x 8-Pin 1x 6-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 2.46 TFLOPSFP16 | Peak OPS 522 TOPSINT4 Tensor |
- | Tensor FP16-16 130.5 TFLOPSTensor FP16-32 65.25 TFLOPS |
- | Tensor BF16 65.25 TFLOPS |
Tensor TF32 - | Tensor TF32 65.25 TFLOPS |
FP32 2.46 TFLOPS | FP32 16.31 TFLOPS |
FP64 153.7 GFLOPS | FP64 509.8 GFLOPS |
Tensor INT4 - | Tensor INT4 522 TOPS |
- | Tensor INT8 261 TOPS |
Ray - | Ray 49.2 TOPS |
Pixel Rate 19.2 GPixel/s | Pixel Rate 169.9 GPixel/s |
Texture Rate 76.9 GTexel/s | Texture Rate 509.8 GTexel/s |
Shaders 1,024 Shaders | Shaders 4,608 Shaders |
TMUs 64 TMUs | TMUs 288 TMUs |
ROPs 16 ROPs | ROPs 96 ROPs |
Tensor Cores - | Tensor Cores 576 T-Cores |
RT Cores - | RT Cores 72 RT-Cores |
CUs 16 CUs | SMs 72 SMs |
Base Clock 1GHz | Base Clock 1.44GHz |
Boost Clock 1.2GHz | Boost Clock 1.77GHz |
L2 Cache 1MB shared | L2 Cache 6MB shared |
4GB GDDR5 | 24GB GDDR6 |
Memory Bus 128-bit | Memory Bus 384-bit |
Memory Speed 6GT/s | Memory Speed 14GT/s |
Memory Bandwidth 96GB/s | Memory Bandwidth 672GB/s |
ECC No | ECC Yes |
TDP 60W | TDP 260W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.2 |
- | 4x DisplayPort 1.4 1x USB-C |
Encoder Model VCE 3.4 | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) | Codec AVC (H.264) HEVC (H.265) |
Decoder Model UVD 6.3 | Decoder Model NVDEC 4 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - - AVC (H.264) HEVC (H.265) | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) |
Form Factor Soldered | Form Factor PCIe Card |
PCIe - | PCIe 2-Slots |
- | Height 111 mm (4.37")Width 267 mm (10.51")Depth 40 mm (1.57") |
Cooling Open-Air - | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 8-Pin, 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Baffin | Codename NV162 |
Chip Variant Polaris 11 XL | Chip Variant TU102-300A-K1-A1 |
Market Segment Laptop | Market Segment Workstation |
Release Date Mar 1, 2017 | Release Date Aug 13, 2018 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node 12FFN |
Die Size 123mm² | Die Size 754mm² |
Transistor Count 3 Billion | Transistor Count 18.6 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 24.67 MTr/mm² |

