AMD Radeon PRO WX 7100 vs GIGABYTE GeForce RTX 3050 OC Low Profile 6G Full Specs
2,304 Shaders 1.24GHz | 2,304 Shaders 1.48GHz |
8GB GDDR5224GB/s | 6GB GDDR6168GB/s |
·· 5.73 TFLOPS | ·· 6.81 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 130W | TDP 70W |
Power Connectors 1x 6-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 5.73 TFLOPSFP16 | Peak OPS 217.8 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 27.22 TFLOPSFP16-16 Tensor Sparse 54.45 TFLOPSTensor FP16-32 13.61 TFLOPSFP16-32 Tensor Sparse 27.22 TFLOPS |
- | BF16 6.81 TFLOPSTensor BF16 13.61 TFLOPSBF16 Tensor Sparse 27.22 TFLOPS |
Tensor TF32 - | Tensor TF32 6.81 TFLOPS |
FP32 5.73 TFLOPS | FP32 6.81 TFLOPS |
FP64 358 GFLOPS | FP64 106.3 GFLOPS |
Tensor INT4 - | Tensor INT4 108.9 TOPS |
- | Tensor INT8 54.45 TOPS |
Ray - | Ray 10.26 TOPS |
Pixel Rate 39.8 GPixel/s | Pixel Rate 47.3 GPixel/s |
Texture Rate 179 GTexel/s | Texture Rate 106.3 GTexel/s |
Shaders 2,304 Shaders | Shaders 2,304 Shaders |
TMUs 144 TMUs | TMUs 72 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 72 T-Cores |
RT Cores - | RT Cores 18 RT-Cores |
CUs 36 CUs | SMs 18 SMs |
Base Clock 1.19GHz | Base Clock 1.04GHz |
Boost Clock 1.24GHz | Boost Clock 1.48GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
8GB GDDR5 | 6GB GDDR6 |
Memory Bus 256-bit | Memory Bus 96-bit |
Memory Speed 7GT/s | Memory Speed 14GT/s |
Memory Bandwidth 224GB/s | Memory Bandwidth 168GB/s |
TDP 130W | TDP 70W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
4x DisplayPort 1.4 | 2x DisplayPort 1.4 |
- | 2x HDMI 2.1 |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 1.8-Slots |
Height 112 mm (4.41")Width 241 mm (9.49")Depth 20 mm (0.79") | Height 69 mm (2.72")Width 181 mm (7.13")Depth 36 mm (1.42") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV177 |
Chip Variant Polaris 10 XL | Chip Variant GA107-140-A1 |
Market Segment Workstation | Market Segment Desktop |
Release Date Nov 10, 2016 | Release Date Feb 2, 2024 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 200mm² |
Transistor Count 5.7 Billion | Transistor Count 8.7 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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