AMD Radeon Pro WX 7100M vs NVIDIA GeForce RTX 3080 Laptop 90W Full Specs
2,304 Shaders 1.24GHz | 6,144 Shaders 1.36GHz |
8GB GDDR5160GB/s | 8GB GDDR6384GB/s |
·· 5.73 TFLOPS | ·· 16.77 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 130W | TDP 90W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 5.73 TFLOPSFP16 | Peak OPS 536.7 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 67.09 TFLOPSFP16-16 Tensor Sparse 134.2 TFLOPSTensor FP16-32 33.55 TFLOPSFP16-32 Tensor Sparse 67.09 TFLOPS |
- | BF16 16.77 TFLOPSTensor BF16 33.55 TFLOPSBF16 Tensor Sparse 67.09 TFLOPS |
Tensor TF32 - | Tensor TF32 16.77 TFLOPS |
FP32 5.73 TFLOPS | FP32 16.77 TFLOPS |
FP64 358 GFLOPS | FP64 262.1 GFLOPS |
Tensor INT4 - | Tensor INT4 268.4 TOPS |
- | Tensor INT8 134.2 TOPS |
Ray - | Ray 25.3 TOPS |
Pixel Rate 39.8 GPixel/s | Pixel Rate 131 GPixel/s |
Texture Rate 179 GTexel/s | Texture Rate 262.1 GTexel/s |
Shaders 2,304 Shaders | Shaders 6,144 Shaders |
TMUs 144 TMUs | TMUs 192 TMUs |
ROPs 32 ROPs | ROPs 96 ROPs |
Tensor Cores - | Tensor Cores 192 T-Cores |
RT Cores - | RT Cores 48 RT-Cores |
CUs 36 CUs | SMs 48 SMs |
Base Clock 1.19GHz | Base Clock 930MHz |
Boost Clock 1.24GHz | Boost Clock 1.36GHz |
L2 Cache 2MB shared | L2 Cache 4.1MB shared |
8GB GDDR5 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 5GT/s | Memory Speed 12GT/s |
Memory Bandwidth 160GB/s | Memory Bandwidth 384GB/s |
TDP 130W | TDP 90W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV174 |
Chip Variant Polaris 10 XL | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Mar 1, 2017 | Release Date Jan 12, 2021 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 393mm² |
Transistor Count 5.7 Billion | Transistor Count 17.4 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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