GPUs

AMD Radeon R3E 2CU 300MHz GCN 2 vs AMD Radeon R4 3CU 464MHz GCN 2 Full Specs

128 Shaders
300MHz
192 Shaders
464MHz
Shared Memory21.3GB/sDDR3
Shared Memory25.6GB/sDDR3
··
76.8 GFLOPS
··
178.2 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R3E 2CU 300MHz GCN 2Radeon R3E 2CU 300MHz GCN 276.8 GFLOPSFP32
x1
Radeon R4 3CU 464MHz GCN 2Radeon R4 3CU 464MHz GCN 2178.2 GFLOPSFP16
x2.32

Clock Speed
··
Clock Speed
··
Peak OPS
76.8 GFLOPSFP32
Peak OPS
178.2 GFLOPSFP16
FP32
76.8 GFLOPS
FP32
178.2 GFLOPS
FP64
4.8 GFLOPS
FP64
11.14 GFLOPS
Pixel Rate
1.2 GPixel/s
Pixel Rate
3.7 GPixel/s
Texture Rate
2.4 GTexel/s
Texture Rate
5.6 GTexel/s

Shaders
128 Shaders
Shaders
192 Shaders
TMUs
8 TMUs
TMUs
12 TMUs
ROPs
4 ROPs
ROPs
8 ROPs
CUs
2 CUs
CUs
3 CUs

Boost Clock
300MHz
Boost Clock
464MHz

L2 Cache
64KB shared
L2 Cache
128KB shared

Shared MemoryDDR3
Shared MemoryDDR3
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.3GT/s
Memory Speed
1.6GT/s
Memory Bandwidth
21.3GB/s
Memory Bandwidth
25.6GB/s

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 2.0
Encoder Model
VCE 2.0

Decoder Model
UVD 4.2
Decoder Model
UVD 4.2

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
Radeon 2013 branding
Codename
Kalindi
Codename
Spectre
Chip Variant
Kalindi LP
Chip Variant
Spectre SL
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 4, 2014
Release Date
May 20, 2014

Foundry
GlobalFoundries
Foundry
GlobalFoundries
Fabrication Node
28nm
Fabrication Node
28nm
Die Size
107mm²
Die Size
245mm²
Transistor Count
930 Million
Transistor Count
2.4 Billion
Transistor Density
9 MTr/mm²
Transistor Density
10 MTr/mm²

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