GPUs

AMD Radeon R7 6CU 900MHz GCN 3 vs AMD Radeon R4 2CU 800MHz GCN 2 Full Specs

384 Shaders
900MHz
128 Shaders
800MHz
Shared Memory38.4GB/sDDR4
Shared Memory29.9GB/s
·
··
691.2 GFLOPS
··
204.8 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Clock Speed
··
Clock Speed
··
Peak OPS
691.2 GFLOPSFP16
Peak OPS
204.8 GFLOPSFP32
FP32
691.2 GFLOPS
FP32
204.8 GFLOPS
FP64
43.2 GFLOPS
FP64
12.8 GFLOPS
Pixel Rate
7.2 GPixel/s
Pixel Rate
3.2 GPixel/s
Texture Rate
21.6 GTexel/s
Texture Rate
6.4 GTexel/s

Shaders
384 Shaders
Shaders
128 Shaders
TMUs
24 TMUs
TMUs
8 TMUs
ROPs
8 ROPs
ROPs
4 ROPs
CUs
6 CUs
CUs
2 CUs

Boost Clock
900MHz
Boost Clock
800MHz

L2 Cache
256KB shared
L2 Cache
64KB shared

Shared MemoryDDR4
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.4GT/s
Memory Speed
1.9GT/s
Memory Bandwidth
38.4GB/s
Memory Bandwidth
29.9GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 3.1
Encoder Model
VCE 2.0
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
-

Decoder Model
UVD 6.0
Decoder Model
UVD 4.2
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
AVC (H.264)
HEVC (H.265)
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
AVC (H.264)
-

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Radeon 2016 branding
Codename
Wani
Codename
Kalindi
Chip Variant
-
Chip Variant
Kalindi LP
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 1, 2016
Release Date
May 1, 2016

Foundry
GlobalFoundries
Foundry
GlobalFoundries
Fabrication Node
28nm
Fabrication Node
28nm
Die Size
250mm²
Die Size
107mm²
Transistor Count
3.1 Billion
Transistor Count
930 Million
Transistor Density
12 MTr/mm²
Transistor Density
9 MTr/mm²