AMD Radeon R7E 6CU 626MHz GCN 3 vs Qualcomm Adreno 722 Full Specs
384 Shaders 626MHz | 512 Shaders 450MHz |
Shared Memory29.9GB/sDDR4 | Shared Memory33.6GB/sLPDDR5X |
·· 480.8 GFLOPS | ·· 460.8 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP 5W |
Radeon R7E 6CU 626MHz GCN 3480.8 GFLOPSFP16
Adreno 722921.6 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 480.8 GFLOPSFP16 | Peak OPS 921.6 GFLOPSFP16 |
FP32 480.8 GFLOPS | FP32 460.8 GFLOPS |
FP64 30.05 GFLOPS | FP64 115.2 GFLOPS |
Pixel Rate 5 GPixel/s | Pixel Rate 7.2 GPixel/s |
Texture Rate 15 GTexel/s | Texture Rate 14.4 GTexel/s |
Shaders 384 Shaders | Shaders 512 Shaders |
TMUs 24 TMUs | TMUs 32 TMUs |
ROPs 8 ROPs | ROPs 16 ROPs |
CUs 6 CUs | EUs 4 EUs |
Boost Clock 626MHz | Boost Clock 450MHz |
L2 Cache 256KB shared | L2 Cache - |
Shared MemoryDDR4 | Shared MemoryLPDDR5X |
Memory Bus 128-bit | Memory Bus 32-bit |
Memory Speed 1.9GT/s | Memory Speed 8.4GT/s |
Memory Bandwidth 29.9GB/s | Memory Bandwidth 33.6GB/s |
ECC No | ECC No |
TDP Shared | TDP 5W |
Multi-Monitor 3 | Multi-Monitor 1 |
Encoder Model VCE 3.1 | Encoder Model Hexagon |
Decoder Model UVD 6.0 | Decoder Model Hexagon |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Wani | Codename - |
Market Segment Laptop | Market Segment Smartphone |
Release Date Feb 23, 2016 | Release Date May 15, 2025 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node N6 |
Die Size 250mm² | Die Size - |
Transistor Count 3.1 Billion | Transistor Count - |
Transistor Density 12 MTr/mm² | Transistor Density - |
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CPUs | CPUs |