AMD Radeon RX 470 vs MSI GeForce RTX 3050 LP 6G OC Full Specs
2,048 Shaders 1.21GHz | 2,304 Shaders 1.49GHz |
4GB GDDR5211.2GB/s | 6GB GDDR6168GB/s |
·· 4.94 TFLOPS | ·· 6.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 120W | TDP 70W |
Power Connectors 1x 6-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 4.94 TFLOPSFP16 | Peak OPS 220 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 27.5 TFLOPSFP16-16 Tensor Sparse 55 TFLOPSTensor FP16-32 13.75 TFLOPSFP16-32 Tensor Sparse 27.5 TFLOPS |
- | BF16 6.88 TFLOPSTensor BF16 13.75 TFLOPSBF16 Tensor Sparse 27.5 TFLOPS |
Tensor TF32 - | Tensor TF32 6.88 TFLOPS |
FP32 4.94 TFLOPS | FP32 6.88 TFLOPS |
FP64 308.7 GFLOPS | FP64 107.4 GFLOPS |
Tensor INT4 - | Tensor INT4 110 TOPS |
- | Tensor INT8 55 TOPS |
Ray - | Ray 10.37 TOPS |
Pixel Rate 38.6 GPixel/s | Pixel Rate 47.7 GPixel/s |
Texture Rate 154.4 GTexel/s | Texture Rate 107.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,304 Shaders |
TMUs 128 TMUs | TMUs 72 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 72 T-Cores |
RT Cores - | RT Cores 18 RT-Cores |
CUs 32 CUs | SMs 18 SMs |
Base Clock 926MHz | Base Clock 1.04GHz |
Boost Clock 1.21GHz | Boost Clock 1.49GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
4GB GDDR5 | 6GB GDDR6 |
Memory Bus 256-bit | Memory Bus 96-bit |
Memory Speed 6.6GT/s | Memory Speed 14GT/s |
Memory Bandwidth 211.2GB/s | Memory Bandwidth 168GB/s |
ECC No | ECC No |
TDP 120W | TDP 70W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
3x DisplayPort 1.4 | 1x DisplayPort 1.4 |
- | 2x HDMI 2.1 |
1x HDMI 2.0 | - |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 95 mm (3.74")Width 240 mm (9.45")Depth 35 mm (1.38") | Height 69 mm (2.72")Width 174 mm (6.85")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV177 |
Chip Variant Polaris 10 XL | Chip Variant GA107-140-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Aug 4, 2016 | Release Date Feb 2, 2024 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 200mm² |
Transistor Count 5.7 Billion | Transistor Count 8.7 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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