GPUs

AMD Radeon RX 560 vs AMD Radeon RX 9060 Full Specs

1,024 Shaders
1.27GHz
1,792 Shaders
2.99GHz
4GB GDDR5112GB/s
8GB GDDR6288GB/s
··
2.61 TFLOPS
··
21.43 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
75W
TDP
132W
Power Connectors
-
Power Connectors
1x 8-Pin

Radeon RX 560Radeon RX 5602.61 TFLOPSFP16
x1
Radeon RX 9060Radeon RX 9060685.8 TOPSINT4 Tensor Sparse
x262.65

Clock Speed
···
Clock Speed
···
Peak OPS
2.61 TFLOPSFP16
Peak OPS
685.8 TOPSINT4 Tensor Sparse
-
Tensor FP8-16
85.73 TFLOPS
FP8-16 Tensor Sparse
171.5 TFLOPS
Tensor FP8-32
85.73 TFLOPS
FP8-32 Tensor Sparse
171.5 TFLOPS
-
Tensor FP16-16
42.86 TFLOPS
FP16-16 Tensor Sparse
85.73 TFLOPS
Tensor FP16-32
42.86 TFLOPS
FP16-32 Tensor Sparse
85.73 TFLOPS
-
BF16
42.86 TFLOPS
Tensor BF16
42.86 TFLOPS
BF16 Tensor Sparse
85.73 TFLOPS
FP32
2.61 TFLOPS
FP32
21.43 TFLOPS
FP64
163.2 GFLOPS
FP64
669.8 GFLOPS
Tensor INT4
-
Tensor INT4
342.9 TOPS
-
Tensor INT8
171.5 TOPS
Pixel Rate
20.4 GPixel/s
Pixel Rate
191.4 GPixel/s
Texture Rate
81.6 GTexel/s
Texture Rate
334.9 GTexel/s

Shaders
1,024 Shaders
Shaders
1,792 Shaders
TMUs
64 TMUs
TMUs
112 TMUs
ROPs
16 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
28 RT-Cores
CUs
16 CUs
CUs
28 CUs

Base Clock
1.18GHz
Base Clock
2.4GHz
Boost Clock
1.27GHz
Boost Clock
2.99GHz

L2 Cache
1MB shared
L2 Cache
4.1MB shared
L3 Cache
-
L3 Cache
32MB shared
L3 Bandwidth
-
L3 Bandwidth
1.13TB/s

4GB GDDR5
8GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7GT/s
Memory Speed
18GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
288GB/s

TDP
75W
TDP
132W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
1x DisplayPort 1.4
-
-
1x HDMI 2.1
1x HDMI 2.0
-
1x DVI-D Dual-Link
-

Encoder Model
VCE 3.4
Encoder Model
VCN 4.0

Decoder Model
UVD 6.3
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
110 mm (4.33")
Width
170 mm (6.69")
Depth
37 mm (1.46")
Height
111 mm (4.37")
Width
204 mm (8.03")
Depth
40 mm (1.57")
Cooling
Open-Air
2x Fans
Cooling
Open-Air
3x Fans
Power Connectors
-
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Radeon 2023 branding
Codename
Baffin
Codename
-
Chip Variant
Polaris 21 XL
Chip Variant
Navi 44 XL
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 18, 2017
Release Date
Aug 5, 2025

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
N4P
Die Size
123mm²
Die Size
153mm²
Transistor Count
3 Billion
Transistor Count
29.7 Billion
Transistor Density
24.39 MTr/mm²
Transistor Density
194.1 MTr/mm²

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