AMD Radeon RX 560 vs AMD Radeon RX 9060 Full Specs
1,024 Shaders 1.27GHz | 1,792 Shaders 2.99GHz |
4GB GDDR5112GB/s | 8GB GDDR6288GB/s |
·· 2.61 TFLOPS | ·· 21.43 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 132W |
Power Connectors - | Power Connectors 1x 8-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 2.61 TFLOPSFP16 | Peak OPS 685.8 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 85.73 TFLOPSFP8-16 Tensor Sparse 171.5 TFLOPSTensor FP8-32 85.73 TFLOPSFP8-32 Tensor Sparse 171.5 TFLOPS |
- | Tensor FP16-16 42.86 TFLOPSFP16-16 Tensor Sparse 85.73 TFLOPSTensor FP16-32 42.86 TFLOPSFP16-32 Tensor Sparse 85.73 TFLOPS |
- | BF16 42.86 TFLOPSTensor BF16 42.86 TFLOPSBF16 Tensor Sparse 85.73 TFLOPS |
FP32 2.61 TFLOPS | FP32 21.43 TFLOPS |
FP64 163.2 GFLOPS | FP64 669.8 GFLOPS |
Tensor INT4 - | Tensor INT4 342.9 TOPS |
- | Tensor INT8 171.5 TOPS |
Pixel Rate 20.4 GPixel/s | Pixel Rate 191.4 GPixel/s |
Texture Rate 81.6 GTexel/s | Texture Rate 334.9 GTexel/s |
Shaders 1,024 Shaders | Shaders 1,792 Shaders |
TMUs 64 TMUs | TMUs 112 TMUs |
ROPs 16 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 16 CUs | CUs 28 CUs |
Base Clock 1.18GHz | Base Clock 2.4GHz |
Boost Clock 1.27GHz | Boost Clock 2.99GHz |
L2 Cache 1MB shared | L2 Cache 4.1MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.13TB/s |
4GB GDDR5 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 7GT/s | Memory Speed 18GT/s |
Memory Bandwidth 112GB/s | Memory Bandwidth 288GB/s |
TDP 75W | TDP 132W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
1x DisplayPort 1.4 | - |
- | 1x HDMI 2.1 |
1x HDMI 2.0 | - |
1x DVI-D Dual-Link | - |
Encoder Model VCE 3.4 | Encoder Model VCN 4.0 |
Decoder Model UVD 6.3 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 110 mm (4.33")Width 170 mm (6.69")Depth 37 mm (1.46") | Height 111 mm (4.37")Width 204 mm (8.03")Depth 40 mm (1.57") |
Cooling Open-Air 2x Fans | Cooling Open-Air 3x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Baffin | Codename - |
Chip Variant Polaris 21 XL | Chip Variant Navi 44 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 18, 2017 | Release Date Aug 5, 2025 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node N4P |
Die Size 123mm² | Die Size 153mm² |
Transistor Count 3 Billion | Transistor Count 29.7 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 194.1 MTr/mm² |
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