AMD Radeon RX 560 vs NVIDIA GeForce RTX 3050 4GB Full Specs
1,024 Shaders 1.27GHz | 2,048 Shaders 1.74GHz |
4GB GDDR5112GB/s | 4GB GDDR6192GB/s |
·· 2.61 TFLOPS | ·· 7.13 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 90W |
Power Connectors - | Power Connectors 1x 6-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 2.61 TFLOPSFP16 | Peak OPS 228.1 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS |
- | BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS |
Tensor TF32 - | Tensor TF32 7.13 TFLOPS |
FP32 2.61 TFLOPS | FP32 7.13 TFLOPS |
FP64 163.2 GFLOPS | FP64 111.4 GFLOPS |
Tensor INT4 - | Tensor INT4 114 TOPS |
- | Tensor INT8 57.02 TOPS |
Ray - | Ray 10.75 TOPS |
Pixel Rate 20.4 GPixel/s | Pixel Rate 55.7 GPixel/s |
Texture Rate 81.6 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 1,024 Shaders | Shaders 2,048 Shaders |
TMUs 64 TMUs | TMUs 64 TMUs |
ROPs 16 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 16 RT-Cores |
CUs 16 CUs | SMs 16 SMs |
Base Clock 1.18GHz | Base Clock 1.54GHz |
Boost Clock 1.27GHz | Boost Clock 1.74GHz |
L2 Cache 1MB shared | L2 Cache 2MB shared |
4GB GDDR5 | 4GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 7GT/s | Memory Speed 12GT/s |
Memory Bandwidth 112GB/s | Memory Bandwidth 192GB/s |
TDP 75W | TDP 90W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
1x DisplayPort 1.4 | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
1x HDMI 2.0 | - |
1x DVI-D Dual-Link | - |
Encoder Model VCE 3.4 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1.9-Slots |
Height 110 mm (4.33")Width 170 mm (6.69")Depth 37 mm (1.46") | Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Baffin | Codename NV177 |
Chip Variant Polaris 21 XL | Chip Variant GA107-140-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 18, 2017 | Release Date Dec 16, 2022 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 123mm² | Die Size 200mm² |
Transistor Count 3 Billion | Transistor Count 8.7 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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