AMD Radeon RX 560X vs AMD Radeon RX 7400 Full Specs
1,024 Shaders 1.27GHz | 1,792 Shaders 1.1GHz |
4GB GDDR5112GB/s | 8GB GDDR6172.8GB/s |
·· 2.61 TFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 55W |
Power Connectors - | Power Connectors 1x 8-Pin |
Radeon RX 560X2.61 TFLOPSFP16
Radeon RX 740031.54 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 2.61 TFLOPSFP16 | Peak OPS 31.54 TOPSINT4 Tensor |
- | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
- | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 2.61 TFLOPS | FP32 7.88 TFLOPS |
FP64 163.2 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 - | Tensor INT4 31.54 TOPS |
- | Tensor INT8 7.88 TOPS |
Pixel Rate 20.4 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 81.6 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 1,024 Shaders | Shaders 1,792 Shaders |
TMUs 64 TMUs | TMUs 112 TMUs |
ROPs 16 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 16 CUs | CUs 28 CUs |
Base Clock 1.18GHz | Base Clock 1GHz |
Boost Clock 1.27GHz | Boost Clock 1.1GHz |
L2 Cache 1MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.16TB/s |
4GB GDDR5 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 7GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 112GB/s | Memory Bandwidth 172.8GB/s |
ECC No | ECC No |
TDP 75W | TDP 55W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 2.1 |
1x DisplayPort 1.4 | - |
- | 1x HDMI 2.1 |
1x HDMI 2.0 | - |
1x DVI-D Dual-Link | - |
Encoder Model VCE 3.4 | Encoder Model VCN 4.0 |
Decoder Model UVD 6.3 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 110 mm (4.33")Width 170 mm (6.69")Depth 37 mm (1.46") | Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Baffin | Codename Hotpink Bonefish |
Chip Variant Polaris 21 XL | Chip Variant Navi 33 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 11, 2018 | Release Date Aug 8, 2025 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node N6 |
Die Size 123mm² | Die Size 204mm² |
Transistor Count 3 Billion | Transistor Count 13.3 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 65.2 MTr/mm² |
No images available
No images available