AMD Radeon RX 560X vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs

Summary

1,024 Shaders 1.27GHz	2,560 Shaders 1.7GHz
4GB GDDR5112GB/s	4GB GDDR6192GB/s
Peak·FP32·FP16 2.61 TFLOPS	Peak·FP32·FP16 8.68 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 75W	TDP 80W

Theoretical Performance

Clock Speed1275MHz UC·Base·Boost·OC	Clock Speed1695MHz UC·Base·Boost·OC
Peak OPS 2.61 TFLOPSFP16	Peak OPS 277.7 TOPSINT4 Tensor Sparse
-	Tensor FP16-16 34.71 TFLOPS FP16-16 Tensor Sparse 69.43 TFLOPS Tensor FP16-32 17.36 TFLOPS FP16-32 Tensor Sparse 34.71 TFLOPS
-	BF16 8.68 TFLOPS Tensor BF16 17.36 TFLOPS BF16 Tensor Sparse 34.71 TFLOPS
Tensor TF32 -	Tensor TF32 8.68 TFLOPS
FP32 2.61 TFLOPS	FP32 8.68 TFLOPS
FP64 163.2 GFLOPS	FP64 135.6 GFLOPS
Tensor INT4 -	Tensor INT4 138.9 TOPS
-	Tensor INT8 69.43 TOPS
Ray -	Ray 13.09 TOPS
Pixel Rate 20.4 GPixel/s	Pixel Rate 54.2 GPixel/s
Texture Rate 81.6 GTexel/s	Texture Rate 135.6 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 2,560 Shaders
TMUs 64 TMUs	TMUs 80 TMUs
ROPs 16 ROPs	ROPs 32 ROPs
Tensor Cores -	Tensor Cores 80 T-Cores
RT Cores -	RT Cores 20 RT-Cores
CUs 16 CUs	SMs 20 SMs

Clocks

Base Clock 1.18GHz	Base Clock 1.46GHz
Boost Clock 1.27GHz	Boost Clock 1.7GHz

Cache

L2 Cache 1MB shared

L2 Cache 2MB shared

Memory

4GB GDDR5	4GB GDDR6
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 7GT/s	Memory Speed 12GT/s
Memory Bandwidth 112GB/s	Memory Bandwidth 192GB/s
ECC No	ECC No

Power & Thermals

TDP 75W

TDP 80W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 2.2	HDCP HDCP 2.3

Ports

1x DisplayPort 1.4 1x HDMI 2.0 1x DVI-D Dual-Link

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Encoder

Encoder Model VCE 3.4	Encoder Model NVENC 7
Codec AVC (H.264) HEVC (H.265)	Codec AVC (H.264) HEVC (H.265)

Decoder

Decoder Model UVD 6.3	Decoder Model NVDEC 5
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - - AVC (H.264) HEVC (H.265) -	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 110 mm (4.33") Width 170 mm (6.69") Depth 37 mm (1.46")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer AMD	Manufacturer NVIDIA
Chip Designer AMD	Chip Designer NVIDIA
Architecture GCN 4	Architecture Ampere
Family Radeon RX 500	Family GeForce 30
Branding	Branding
Codename Baffin	Codename NV177
Chip Variant Polaris 21 XL	Chip Variant GA107-140-A1
Market Segment Desktop	Market Segment Laptop
Release Date Apr 11, 2018	Release Date May 11, 2021

Fabrication

Foundry GlobalFoundries	Foundry Samsung
Fabrication Node 14LPP	Fabrication Node 8N
Die Size 123mm²	Die Size 200mm²
Transistor Count 3 Billion	Transistor Count 8.7 Billion
Transistor Density 24.39 MTr/mm²	Transistor Density 43.5 MTr/mm²

Images