GPUs

AMD Radeon RX 5700M vs NVIDIA GeForce RTX 3060 Laptop 70W Full Specs

2,304 Shaders
1.72GHz
3,840 Shaders
1.4GHz
8GB GDDR6384GB/s
6GB GDDR6288GB/s
··
7.93 TFLOPS
··
10.77 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
120W
TDP
70W

Clock Speed
···
Clock Speed
···
Peak OPS
15.85 TFLOPSFP16
Peak OPS
344.6 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
43.07 TFLOPS
FP16-16 Tensor Sparse
86.14 TFLOPS
Tensor FP16-32
21.53 TFLOPS
FP16-32 Tensor Sparse
43.07 TFLOPS
-
BF16
10.77 TFLOPS
Tensor BF16
21.53 TFLOPS
BF16 Tensor Sparse
43.07 TFLOPS
Tensor TF32
-
Tensor TF32
10.77 TFLOPS
FP32
7.93 TFLOPS
FP32
10.77 TFLOPS
FP64
495.4 GFLOPS
FP64
168.2 GFLOPS
Tensor INT4
-
Tensor INT4
172.3 TOPS
-
Tensor INT8
86.14 TOPS
Ray
-
Ray
16.24 TOPS
Pixel Rate
110.1 GPixel/s
Pixel Rate
67.3 GPixel/s
Texture Rate
247.7 GTexel/s
Texture Rate
168.2 GTexel/s

Shaders
2,304 Shaders
Shaders
3,840 Shaders
TMUs
144 TMUs
TMUs
120 TMUs
ROPs
64 ROPs
ROPs
48 ROPs
Tensor Cores
-
Tensor Cores
120 T-Cores
RT Cores
-
RT Cores
30 RT-Cores
CUs
36 CUs
SMs
30 SMs

Base Clock
1.47GHz
Base Clock
1.05GHz
Boost Clock
1.72GHz
Boost Clock
1.4GHz

L2 Cache
4MB shared
L2 Cache
3MB shared

8GB GDDR6
6GB GDDR6
Memory Bus
256-bit
Memory Bus
192-bit
Memory Speed
12GT/s
Memory Speed
12GT/s
Memory Bandwidth
384GB/s
Memory Bandwidth
288GB/s
ECC
No
ECC
No

TDP
120W
TDP
70W

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.3

Encoder Model
VCN 2.0
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
VCN 2.0
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
VP9
AVC (H.264)
HEVC (H.265)
-
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon RX 2019 branding
Branding
GeForce RTX 2018 branding
Codename
Gaming
Codename
NV176
Chip Variant
Navi 10 XE
Chip Variant
GA106-150-KA-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 1, 2020
Release Date
Feb 25, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
8N
Die Size
251mm²
Die Size
276mm²
Transistor Count
10.3 Billion
Transistor Count
13.3 Billion
Transistor Density
41.04 MTr/mm²
Transistor Density
48.01 MTr/mm²