AMD Radeon RX 580X vs MSI GeForce RTX 3050 Ventus 2X OC Full Specs
2,304 Shaders 1.34GHz | 2,560 Shaders 1.81GHz |
8GB GDDR5256GB/s | 8GB GDDR6224GB/s |
·· 6.17 TFLOPS | ·· 9.25 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 185W | TDP 130W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Radeon RX 580X6.17 TFLOPSFP16
GeForce RTX 3050 Ventus 2X OC296.1 TOPSINT4 Tensor SparseClock Speed ··· | Clock Speed ··· |
Peak OPS 6.17 TFLOPSFP16 | Peak OPS 296.1 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 37.01 TFLOPSFP16-16 Tensor Sparse 74.01 TFLOPSTensor FP16-32 18.5 TFLOPSFP16-32 Tensor Sparse 37.01 TFLOPS |
- | BF16 9.25 TFLOPSTensor BF16 18.5 TFLOPSBF16 Tensor Sparse 37.01 TFLOPS |
Tensor TF32 - | Tensor TF32 9.25 TFLOPS |
FP32 6.17 TFLOPS | FP32 9.25 TFLOPS |
FP64 385.9 GFLOPS | FP64 144.6 GFLOPS |
Tensor INT4 - | Tensor INT4 148 TOPS |
- | Tensor INT8 74.01 TOPS |
Ray - | Ray 13.95 TOPS |
Pixel Rate 42.9 GPixel/s | Pixel Rate 86.7 GPixel/s |
Texture Rate 193 GTexel/s | Texture Rate 144.6 GTexel/s |
Shaders 2,304 Shaders | Shaders 2,560 Shaders |
TMUs 144 TMUs | TMUs 80 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 80 T-Cores |
RT Cores - | RT Cores 20 RT-Cores |
CUs 36 CUs | SMs 20 SMs |
Base Clock 1.26GHz | Base Clock 1.55GHz |
Boost Clock 1.34GHz | Boost Clock 1.81GHz |
L2 Cache 2MB shared | L2 Cache 3.1MB shared |
8GB GDDR5 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 8GT/s | Memory Speed 14GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 224GB/s |
TDP 185W | TDP 130W |
Max Temp - | Max Temp 93°C Max |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
3x DisplayPort 1.4 | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
1x HDMI 2.0 | - |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.1-Slots |
Height 110 mm (4.33")Width 241 mm (9.49")Depth 37 mm (1.46") | Height 124 mm (4.88")Width 235 mm (9.25")Depth 42 mm (1.65") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Ellesmere | Codename NV176 |
Chip Variant Polaris 20 XL | Chip Variant GA106-150-KA-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 11, 2018 | Release Date Jan 27, 2022 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 276mm² |
Transistor Count 5.7 Billion | Transistor Count 13.3 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 48.01 MTr/mm² |
No images available
No images available