AMD Radeon RX 580X vs NVIDIA GeForce RTX 2060 Laptop Full Specs
2,304 Shaders 1.34GHz | 1,920 Shaders 1.2GHz |
8GB GDDR5256GB/s | 6GB GDDR6336GB/s |
·· 6.17 TFLOPS | ·· 4.61 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 185W | TDP 80W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 6.17 TFLOPSFP16 | Peak OPS 9.22 TFLOPSFP16 |
FP32 6.17 TFLOPS | FP32 4.61 TFLOPS |
FP64 385.9 GFLOPS | FP64 144 GFLOPS |
Pixel Rate 42.9 GPixel/s | Pixel Rate 57.6 GPixel/s |
Texture Rate 193 GTexel/s | Texture Rate 144 GTexel/s |
Shaders 2,304 Shaders | Shaders 1,920 Shaders |
TMUs 144 TMUs | TMUs 120 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 240 T-Cores |
RT Cores - | RT Cores 30 RT-Cores |
CUs 36 CUs | SMs 30 SMs |
Base Clock 1.26GHz | Base Clock 960MHz |
Boost Clock 1.34GHz | Boost Clock 1.2GHz |
L2 Cache 2MB shared | L2 Cache 3MB shared |
8GB GDDR5 | 6GB GDDR6 |
Memory Bus 256-bit | Memory Bus 192-bit |
Memory Speed 8GT/s | Memory Speed 14GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP 185W | TDP 80W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.2 |
3x DisplayPort 1.4 1x HDMI 2.0 | - |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) | Codec AVC (H.264) HEVC (H.265) |
Decoder Model UVD 6.3 | Decoder Model NVDEC 4 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - - AVC (H.264) HEVC (H.265) | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 110 mm (4.33")Width 241 mm (9.49")Depth 37 mm (1.46") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV166 |
Chip Variant Polaris 20 XL | Chip Variant TU106-125-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Apr 11, 2018 | Release Date Jan 29, 2019 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node 12FFN |
Die Size 232mm² | Die Size 445mm² |
Transistor Count 5.7 Billion | Transistor Count 10.8 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 24.27 MTr/mm² |

