GPUs

AMD Radeon RX 6700M vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs

2,304 Shaders
2.4GHz
2,560 Shaders
1.7GHz
12GB GDDR6384GB/s
4GB GDDR6192GB/s
··
11.06 TFLOPS
··
8.68 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
135W
TDP
80W

Radeon RX 6700MRadeon RX 6700M22.12 TFLOPSFP16
x1
GeForce RTX 3050 Ti Laptop 80WGeForce RTX 3050 Ti Laptop 80W277.7 TOPSINT4 Tensor Sparse
x12.56

Clock Speed
···
Clock Speed
···
Peak OPS
22.12 TFLOPSFP16
Peak OPS
277.7 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
34.71 TFLOPS
FP16-16 Tensor Sparse
69.43 TFLOPS
Tensor FP16-32
17.36 TFLOPS
FP16-32 Tensor Sparse
34.71 TFLOPS
-
BF16
8.68 TFLOPS
Tensor BF16
17.36 TFLOPS
BF16 Tensor Sparse
34.71 TFLOPS
Tensor TF32
-
Tensor TF32
8.68 TFLOPS
FP32
11.06 TFLOPS
FP32
8.68 TFLOPS
FP64
691.2 GFLOPS
FP64
135.6 GFLOPS
Tensor INT4
-
Tensor INT4
138.9 TOPS
-
Tensor INT8
69.43 TOPS
Ray
-
Ray
13.09 TOPS
Pixel Rate
153.6 GPixel/s
Pixel Rate
54.2 GPixel/s
Texture Rate
345.6 GTexel/s
Texture Rate
135.6 GTexel/s

Shaders
2,304 Shaders
Shaders
2,560 Shaders
TMUs
144 TMUs
TMUs
80 TMUs
ROPs
64 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
36 RT-Cores
RT Cores
20 RT-Cores
CUs
36 CUs
SMs
20 SMs

Base Clock
1.49GHz
Base Clock
1.46GHz
Boost Clock
2.4GHz
Boost Clock
1.7GHz

L2 Cache
3.1MB shared
L2 Cache
2MB shared
L3 Cache
80MB shared
L3 Cache
-
L3 Bandwidth
1.25TB/s
L3 Bandwidth
-

12GB GDDR6
4GB GDDR6
Memory Bus
192-bit
Memory Bus
128-bit
Memory Speed
16GT/s
Memory Speed
12GT/s
Memory Bandwidth
384GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
135W
TDP
80W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.3

Encoder Model
VCN 3.0
Encoder Model
NVENC 7

Decoder Model
VCN 3.0
Decoder Model
NVDEC 5

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2020 branding
Branding
GeForce RTX 2018 branding
Codename
Navy Flounder
Codename
NV177
Chip Variant
Navi 22 XT
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 1, 2021
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
8N
Die Size
335mm²
Die Size
200mm²
Transistor Count
17.2 Billion
Transistor Count
8.7 Billion
Transistor Density
51.34 MTr/mm²
Transistor Density
43.5 MTr/mm²

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