AMD Radeon RX 6750 XT vs Intel Arc A770 Full Specs
2,560 Shaders 2.6GHz | 4,096 Shaders 2.4GHz |
12GB GDDR6432GB/s | 8GB GDDR6512GB/s |
·· 13.31 TFLOPS | ·· 19.66 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 250W | TDP 225W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Radeon RX 6750 XT26.62 TFLOPSFP16
Arc A770629.1 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 26.62 TFLOPSFP16 | Peak OPS 629.1 TOPSINT4 Tensor |
- | Tensor FP16-32 157.3 TFLOPS |
- | Tensor BF16 157.3 TFLOPS |
FP32 13.31 TFLOPS | FP32 19.66 TFLOPS |
FP64 832 GFLOPS | FP64 4.92 TFLOPS |
Tensor INT4 - | Tensor INT4 629.1 TOPS |
- | Tensor INT8 314.6 TOPS |
Pixel Rate 166.4 GPixel/s | Pixel Rate 307.2 GPixel/s |
Texture Rate 416 GTexel/s | Texture Rate 614.4 GTexel/s |
Shaders 2,560 Shaders | Shaders 4,096 Shaders |
TMUs 160 TMUs | TMUs 256 TMUs |
ROPs 64 ROPs | ROPs 128 ROPs |
Tensor Cores - | Tensor Cores 512 T-Cores |
RT Cores 40 RT-Cores | RT Cores 32 RT-Cores |
CUs 40 CUs | EUs 512 EUs |
Base Clock 2.15GHz | Base Clock 2.1GHz |
Boost Clock 2.6GHz | Boost Clock 2.4GHz |
L2 Cache 3.1MB shared | L2 Cache 8.2MB shared |
L3 Cache 96MB shared | L3 Cache - |
L3 Bandwidth 1.25TB/s | L3 Bandwidth - |
12GB GDDR6 | 8GB GDDR6 |
Memory Bus 192-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 16GT/s |
Memory Bandwidth 432GB/s | Memory Bandwidth 512GB/s |
TDP 250W | TDP 225W |
Max Temp 110°C Max | Max Temp - |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
- | 3x DisplayPort 2.0 |
2x DisplayPort 1.4 | - |
1x HDMI 2.1 | 1x HDMI 2.1 |
1x USB-C | - |
Encoder Model VCN 3.0 | Encoder Model Arc |
Decoder Model VCN 3.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 110 mm (4.33")Width 267 mm (10.51")Depth 40 mm (1.57") | Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") |
Cooling Open-Air 3x Fans | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Navy Flounder | Codename Xe HPG |
Chip Variant Navi 22 XT | Chip Variant DG2-512 |
Market Segment Desktop | Market Segment Desktop |
Release Date May 10, 2022 | Release Date Oct 14, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N7 | Fabrication Node N6 |
Die Size 335mm² | Die Size 406mm² |
Transistor Count 17.2 Billion | Transistor Count 21.7 Billion |
Transistor Density 51.34 MTr/mm² | Transistor Density 53.45 MTr/mm² |
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