AMD Radeon RX 6800M vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs
2,560 Shaders 2.42GHz | 2,048 Shaders 1.74GHz |
12GB GDDR6384GB/s | 4GB GDDR6192GB/s |
·· 12.41 TFLOPS | ·· 7.13 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 145W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 24.82 TFLOPSFP16 | Peak OPS 228.1 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS |
- | BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS |
Tensor TF32 - | Tensor TF32 7.13 TFLOPS |
FP32 12.41 TFLOPS | FP32 7.13 TFLOPS |
FP64 775.7 GFLOPS | FP64 111.4 GFLOPS |
Tensor INT4 - | Tensor INT4 114 TOPS |
- | Tensor INT8 57.02 TOPS |
Ray - | Ray 10.75 TOPS |
Pixel Rate 155.1 GPixel/s | Pixel Rate 55.7 GPixel/s |
Texture Rate 387.8 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,048 Shaders |
TMUs 160 TMUs | TMUs 64 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores 40 RT-Cores | RT Cores 16 RT-Cores |
CUs 40 CUs | SMs 16 SMs |
Base Clock 2.3GHz | Base Clock 1.49GHz |
Boost Clock 2.42GHz | Boost Clock 1.74GHz |
L2 Cache 3.1MB shared | L2 Cache 2MB shared |
L3 Cache 96MB shared | L3 Cache - |
L3 Bandwidth 1.25TB/s | L3 Bandwidth - |
12GB GDDR6 | 4GB GDDR6 |
Memory Bus 192-bit | Memory Bus 128-bit |
Memory Speed 16GT/s | Memory Speed 12GT/s |
Memory Bandwidth 384GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 145W | TDP 80W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
Encoder Model VCN 3.0 | Encoder Model NVENC 7 |
Decoder Model VCN 3.0 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Navy Flounder | Codename NV177 |
Chip Variant Navi 22 XT | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 31, 2021 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N7 | Fabrication Node 8N |
Die Size 335mm² | Die Size 200mm² |
Transistor Count 17.2 Billion | Transistor Count 8.7 Billion |
Transistor Density 51.34 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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