GPUs

AMD Radeon RX 9060 vs Apple FirePro D500 Full Specs

1,792 Shaders
2.99GHz
1,536 Shaders
725MHz
8GB GDDR6288GB/s
3GB GDDR5243.8GB/s
··
21.43 TFLOPS
··
2.23 TFLOPS
Form Factor
PCIe Card
Form Factor
Mac Pro Card
TDP
132W
TDP
220W
Power Connectors
1x 8-Pin
Power Connectors
-

Radeon RX 9060Radeon RX 9060685.8 TOPSINT4 Tensor Sparse
x307.94
FirePro D500FirePro D5002.23 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
685.8 TOPSINT4 Tensor Sparse
Peak OPS
2.23 TFLOPSFP32
Tensor FP8-16
85.73 TFLOPS
FP8-16 Tensor Sparse
171.5 TFLOPS
Tensor FP8-32
85.73 TFLOPS
FP8-32 Tensor Sparse
171.5 TFLOPS
-
Tensor FP16-16
42.86 TFLOPS
FP16-16 Tensor Sparse
85.73 TFLOPS
Tensor FP16-32
42.86 TFLOPS
FP16-32 Tensor Sparse
85.73 TFLOPS
-
BF16
42.86 TFLOPS
Tensor BF16
42.86 TFLOPS
BF16 Tensor Sparse
85.73 TFLOPS
-
FP32
21.43 TFLOPS
FP32
2.23 TFLOPS
FP64
669.8 GFLOPS
FP64
556.8 GFLOPS
Tensor INT4
342.9 TOPS
Tensor INT4
-
Tensor INT8
171.5 TOPS
-
Pixel Rate
191.4 GPixel/s
Pixel Rate
23.2 GPixel/s
Texture Rate
334.9 GTexel/s
Texture Rate
69.6 GTexel/s

Shaders
1,792 Shaders
Shaders
1,536 Shaders
TMUs
112 TMUs
TMUs
96 TMUs
ROPs
64 ROPs
ROPs
32 ROPs
Tensor Cores
56 T-Cores
Tensor Cores
-
RT Cores
28 RT-Cores
RT Cores
-
CUs
28 CUs
CUs
24 CUs

Base Clock
2.4GHz
Base Clock
-
Boost Clock
2.99GHz
Boost Clock
725MHz

L2 Cache
4.1MB shared
L2 Cache
768KB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.13TB/s
L3 Bandwidth
-

8GB GDDR6
3GB GDDR5
Memory Bus
128-bit
Memory Bus
384-bit
Memory Speed
18GT/s
Memory Speed
5.1GT/s
Memory Bandwidth
288GB/s
Memory Bandwidth
243.8GB/s
ECC
No
ECC
No

TDP
132W
TDP
220W

Multi-Monitor
3
Multi-Monitor
6
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 2.1
-
1x HDMI 2.1
-

Encoder Model
VCN 4.0
Encoder Model
VCE 1.0

Decoder Model
VCN 4.0
Decoder Model
UVD 3.2

Form Factor
PCIe Card
Form Factor
Mac Pro Card
PCIe
2-Slots
PCIe
-
Height
111 mm (4.37")
Width
204 mm (8.03")
Depth
40 mm (1.57")
-
Cooling
Open-Air
3x Fans
Cooling
Passive
-
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
FirePro 2014 branding
Codename
-
Codename
Tahiti
Chip Variant
Navi 44 XL
Chip Variant
Tahiti LE
Market Segment
Desktop
Market Segment
Workstation
Release Date
Aug 5, 2025
Release Date
Jan 18, 2014

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
28nm
Die Size
153mm²
Die Size
352mm²
Transistor Count
29.7 Billion
Transistor Count
4.3 Billion
Transistor Density
194.1 MTr/mm²
Transistor Density
12.25 MTr/mm²

No images available
No images available

Desktops
-
Desktops