Apple FirePro D500 vs AMD Radeon PRO W7500 Full Specs

Summary

1,536 Shaders 725MHz	1,792 Shaders 1.7GHz
3GB GDDR5243.8GB/s	8GB GDDR6172GB/s
Peak·FP32·FP16 2.23 TFLOPS	Peak·FP32·FP16 12.19 TFLOPS
Form Factor Mac Pro Card	Form Factor PCIe Card
TDP 220W	TDP 70W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

FirePro D5002.23 TFLOPSFP32

x1

Radeon PRO W750048.74 TOPSINT4 Tensor

x21.89

Show Top Score

Theoretical Performance

Clock Speed725MHz UC·Boost·OC	Clock Speed1700MHz UC·Base·Boost·OC
Peak OPS 2.23 TFLOPSFP32	Peak OPS 48.74 TOPSINT4 Tensor
-	Tensor FP16-16 12.19 TFLOPS Tensor FP16-32 12.19 TFLOPS
-	BF16 24.37 TFLOPS Tensor BF16 12.19 TFLOPS
FP32 2.23 TFLOPS	FP32 12.19 TFLOPS
FP64 556.8 GFLOPS	FP64 380.8 GFLOPS
Tensor INT4 -	Tensor INT4 48.74 TOPS
-	Tensor INT8 12.19 TOPS
Pixel Rate 23.2 GPixel/s	Pixel Rate 108.8 GPixel/s
Texture Rate 69.6 GTexel/s	Texture Rate 190.4 GTexel/s

Core Config

Shaders 1,536 Shaders	Shaders 1,792 Shaders
TMUs 96 TMUs	TMUs 112 TMUs
ROPs 32 ROPs	ROPs 64 ROPs
Tensor Cores -	Tensor Cores 56 T-Cores
RT Cores -	RT Cores 28 RT-Cores
CUs 24 CUs	CUs 28 CUs

Clocks

Base Clock -	Base Clock 1.5GHz
Boost Clock 725MHz	Boost Clock 1.7GHz

Cache

L2 Cache 768KB shared	L2 Cache 2MB shared
L3 Cache -	L3 Cache 32MB shared
L3 Bandwidth -	L3 Bandwidth 1.17TB/s

Memory

3GB GDDR5	8GB GDDR6
Memory Bus 384-bit	Memory Bus 128-bit
Memory Speed 5.1GT/s	Memory Speed 10.8GT/s
Memory Bandwidth 243.8GB/s	Memory Bandwidth 172GB/s
ECC No	ECC No

Power & Thermals

TDP 220W

TDP 70W

Video Output

Multi-Monitor 6	Multi-Monitor 3
HDCP -	HDCP HDCP 2.3

Ports

-	4x DisplayPort 2.1

Encoder

Encoder Model VCE 1.0

Encoder Model VCN 4.0

Decoder

Decoder Model UVD 3.2

Decoder Model VCN 4.0

Card

Form Factor Mac Pro Card	Form Factor PCIe Card
PCIe -	PCIe 1-Slots
-	Height 115 mm (4.53") Width 216 mm (8.5") Depth 20 mm (0.79")
Cooling Passive -	Cooling Blower 1x Fan

Chip

Manufacturer Apple	Manufacturer AMD
Chip Designer AMD	Chip Designer AMD
Architecture GCN 1	Architecture RDNA 3
Family FirePro D	Family Radeon PRO W
Branding	Branding
Codename Tahiti	Codename Hotpink Bonefish
Chip Variant Tahiti LE	Chip Variant Navi 33 XL
Market Segment Workstation	Market Segment Workstation
Release Date Jan 18, 2014	Release Date Aug 3, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node N6
Die Size 352mm²	Die Size 204mm²
Transistor Count 4.3 Billion	Transistor Count 13.3 Billion
Transistor Density 12.25 MTr/mm²	Transistor Density 65.2 MTr/mm²

Images

No images available

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Used In

Desktops Mac Pro(Late 2013)

Desktops -

Competitors

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