AMD Radeon RX M550X vs Intel Graphics 4C 2500MHz Full Specs

Summary

640 Shaders 1.29GHz	512 Shaders 2.5GHz
2GB GDDR596GB/s placeholder	Shared Memory136.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.65 TFLOPS	Peak·FP32·FP16 2.56 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 50W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon RX M550X1.65 TFLOPSFP16

x1

Graphics 4C 2500MHz81.92 TOPSINT4 Tensor

x49.73

Show Top Score

Theoretical Performance

Clock Speed1287MHz UC·Base·Boost·OC	Clock Speed2500MHz UC·Boost·OC
Peak OPS 1.65 TFLOPSFP16	Peak OPS 81.92 TOPSINT4 Tensor
-	Tensor FP16-32 20.48 TFLOPS
-	Tensor BF16 20.48 TFLOPS
FP32 1.65 TFLOPS	FP32 2.56 TFLOPS
FP64 103 GFLOPS	FP64 640 GFLOPS
Tensor INT4 -	Tensor INT4 81.92 TOPS
-	Tensor INT8 40.96 TOPS
Pixel Rate 20.6 GPixel/s	Pixel Rate 40 GPixel/s
Texture Rate 51.5 GTexel/s	Texture Rate 80 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 512 Shaders
TMUs 40 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 32 T-Cores
RT Cores -	RT Cores 4 RT-Cores
CUs 10 CUs	EUs 32 EUs

Clocks

Base Clock 1.1GHz	Base Clock -
Boost Clock 1.29GHz	Boost Clock 2.5GHz

Cache

L2 Cache 512KB shared

L2 Cache 4.1MB shared

Memory

2GB GDDR5 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 6GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 96GB/s	Memory Bandwidth 136.5GB/s
ECC No	ECC No

Power & Thermals

TDP 50W

TDP Shared

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 2.2	HDCP -

Encoder

Encoder Model VCE 3.4

Encoder Model Xe Media Engine

Decoder

Decoder Model UVD 6.3

Decoder Model Xe Media Engine

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 4	Architecture Battlemage
Family Radeon RX 500	Family Gen 13
Branding	Branding
Codename Lexa	Codename Xe3 LPG
Chip Variant Polaris 23 XLM	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Apr 11, 2018	Release Date Jan 5, 2026

Fabrication

Foundry GlobalFoundries	Foundry Intel
Fabrication Node 14LPP	Fabrication Node Intel 3
Die Size 103mm²	Die Size 27mm²
Transistor Count 2.2 Billion	Transistor Count -
Transistor Density 21.36 MTr/mm²	Transistor Density -

Images

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Used In

CPUs -

CPUs Core Ultra 7 355 Core Ultra 7 365 Core Ultra 7 366H Show 1 more

Competitors

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