Apple 8-Core M3 vs Apple Radeon Pro 570X Full Specs
1,024 Shaders 1.34GHz | 1,792 Shaders 1.1GHz |
Shared Memory102.4GB/sLPDDR5 | 4GB GDDR5217.6GB/s placeholder |
·· 2.74 TFLOPS | ·· 3.96 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 95W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 2.74 TFLOPSFP16 | Peak OPS 3.96 TFLOPSFP16 |
FP32 2.74 TFLOPS | FP32 3.96 TFLOPS |
- | FP64 247.5 GFLOPS |
Pixel Rate 42.8 GPixel/s | Pixel Rate 35.4 GPixel/s |
Texture Rate 85.6 GTexel/s | Texture Rate 123.8 GTexel/s |
Shaders 1,024 Shaders | Shaders 1,792 Shaders |
TMUs 64 TMUs | TMUs 112 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
RT Cores 8 RT-Cores | RT Cores - |
EUs 128 EUs | CUs 28 CUs |
Base Clock - | Base Clock 1GHz |
Boost Clock 1.34GHz | Boost Clock 1.1GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
Shared MemoryLPDDR5 | 4GB GDDR5 placeholder |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 6.4GT/s | Memory Speed 6.8GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 217.6GB/s |
ECC No | ECC No |
TDP Shared | TDP 95W |
Multi-Monitor 1 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.2 |
Encoder Model Apple Media Engine 3 | Encoder Model VCE 3.0 |
Decoder Model Apple Media Engine 3 | Decoder Model UVD 6.3 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G15G | Codename Ellesmere |
Chip Variant - | Chip Variant Polaris 20 XL |
Market Segment Laptop | Market Segment Laptop |
Release Date Oct 30, 2023 | Release Date Mar 18, 2019 |
Foundry TSMC | Foundry GlobalFoundries |
Fabrication Node N3B | Fabrication Node 14LPP |
Die Size 153mm² | Die Size 232mm² |
Transistor Count 25 Billion | Transistor Count 5.7 Billion |
Transistor Density 164 MTr/mm² | Transistor Density 24.57 MTr/mm² |
No images available
No images available
CPUs | CPUs - |
All-in-Ones | All-in-Ones |



