GPUs

Apple FirePro D500 vs AMD Radeon RX 9060 Full Specs

1,536 Shaders
725MHz
1,792 Shaders
2.99GHz
3GB GDDR5243.8GB/s
8GB GDDR6288GB/s
··
2.23 TFLOPS
··
21.43 TFLOPS
Form Factor
Mac Pro Card
Form Factor
PCIe Card
TDP
220W
TDP
132W
Power Connectors
-
Power Connectors
1x 8-Pin

FirePro D500FirePro D5002.23 TFLOPSFP32
x1
Radeon RX 9060Radeon RX 9060685.8 TOPSINT4 Tensor Sparse
x307.94

Clock Speed
··
Clock Speed
···
Peak OPS
2.23 TFLOPSFP32
Peak OPS
685.8 TOPSINT4 Tensor Sparse
-
Tensor FP8-16
85.73 TFLOPS
FP8-16 Tensor Sparse
171.5 TFLOPS
Tensor FP8-32
85.73 TFLOPS
FP8-32 Tensor Sparse
171.5 TFLOPS
-
Tensor FP16-16
42.86 TFLOPS
FP16-16 Tensor Sparse
85.73 TFLOPS
Tensor FP16-32
42.86 TFLOPS
FP16-32 Tensor Sparse
85.73 TFLOPS
-
BF16
42.86 TFLOPS
Tensor BF16
42.86 TFLOPS
BF16 Tensor Sparse
85.73 TFLOPS
FP32
2.23 TFLOPS
FP32
21.43 TFLOPS
FP64
556.8 GFLOPS
FP64
669.8 GFLOPS
Tensor INT4
-
Tensor INT4
342.9 TOPS
-
Tensor INT8
171.5 TOPS
Pixel Rate
23.2 GPixel/s
Pixel Rate
191.4 GPixel/s
Texture Rate
69.6 GTexel/s
Texture Rate
334.9 GTexel/s

Shaders
1,536 Shaders
Shaders
1,792 Shaders
TMUs
96 TMUs
TMUs
112 TMUs
ROPs
32 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
28 RT-Cores
CUs
24 CUs
CUs
28 CUs

Base Clock
-
Base Clock
2.4GHz
Boost Clock
725MHz
Boost Clock
2.99GHz

L2 Cache
768KB shared
L2 Cache
4.1MB shared
L3 Cache
-
L3 Cache
32MB shared
L3 Bandwidth
-
L3 Bandwidth
1.13TB/s

3GB GDDR5
8GB GDDR6
Memory Bus
384-bit
Memory Bus
128-bit
Memory Speed
5.1GT/s
Memory Speed
18GT/s
Memory Bandwidth
243.8GB/s
Memory Bandwidth
288GB/s
ECC
No
ECC
No

TDP
220W
TDP
132W

Multi-Monitor
6
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
-
1x HDMI 2.1

Encoder Model
VCE 1.0
Encoder Model
VCN 4.0

Decoder Model
UVD 3.2
Decoder Model
VCN 4.0

Form Factor
Mac Pro Card
Form Factor
PCIe Card
PCIe
-
PCIe
2-Slots
-
Height
111 mm (4.37")
Width
204 mm (8.03")
Depth
40 mm (1.57")
Cooling
Passive
-
Cooling
Open-Air
3x Fans
Power Connectors
-
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro 2014 branding
Branding
Radeon 2023 branding
Codename
Tahiti
Codename
-
Chip Variant
Tahiti LE
Chip Variant
Navi 44 XL
Market Segment
Workstation
Market Segment
Desktop
Release Date
Jan 18, 2014
Release Date
Aug 5, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N4P
Die Size
352mm²
Die Size
153mm²
Transistor Count
4.3 Billion
Transistor Count
29.7 Billion
Transistor Density
12.25 MTr/mm²
Transistor Density
194.1 MTr/mm²

No images available
No images available

Desktops
Desktops
-