Apple Radeon Pro 5300M vs NVIDIA GeForce RTX 3060 Laptop 80W Full Specs
1,280 Shaders 1.25GHz | 3,840 Shaders 1.43GHz |
4GB GDDR6192GB/s | 6GB GDDR6336GB/s |
·· 3.2 TFLOPS | ·· 10.94 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 50W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 6.4 TFLOPSFP16 | Peak OPS 350.2 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 43.78 TFLOPSFP16-16 Tensor Sparse 87.55 TFLOPSTensor FP16-32 21.89 TFLOPSFP16-32 Tensor Sparse 43.78 TFLOPS |
- | BF16 10.94 TFLOPSTensor BF16 21.89 TFLOPSBF16 Tensor Sparse 43.78 TFLOPS |
Tensor TF32 - | Tensor TF32 10.94 TFLOPS |
FP32 3.2 TFLOPS | FP32 10.94 TFLOPS |
FP64 200 GFLOPS | FP64 171 GFLOPS |
Tensor INT4 - | Tensor INT4 175.1 TOPS |
- | Tensor INT8 87.55 TOPS |
Ray - | Ray 16.51 TOPS |
Pixel Rate 40 GPixel/s | Pixel Rate 68.4 GPixel/s |
Texture Rate 100 GTexel/s | Texture Rate 171 GTexel/s |
Shaders 1,280 Shaders | Shaders 3,840 Shaders |
TMUs 80 TMUs | TMUs 120 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 120 T-Cores |
RT Cores - | RT Cores 30 RT-Cores |
CUs 20 CUs | SMs 30 SMs |
Base Clock 1GHz | Base Clock 900MHz |
Boost Clock 1.25GHz | Boost Clock 1.43GHz |
L2 Cache 2MB shared | L2 Cache 3MB shared |
4GB GDDR6 | 6GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 12GT/s | Memory Speed 14GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP 50W | TDP 80W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
Encoder Model VCN 2.0 | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) | Codec AVC (H.264) HEVC (H.265) |
Decoder Model VCN 2.0 | Decoder Model NVDEC 5 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - VP9 AVC (H.264) HEVC (H.265) - | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Fighter | Codename NV176 |
Chip Variant Navi 14 XE | Chip Variant GA106-150-KA-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Nov 13, 2019 | Release Date Feb 25, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N7 | Fabrication Node 8N |
Die Size 158mm² | Die Size 276mm² |
Transistor Count 6.4 Billion | Transistor Count 13.3 Billion |
Transistor Density 40.51 MTr/mm² | Transistor Density 48.01 MTr/mm² |