Apple Radeon Pro 555X vs Intel UHD 730 1400MHz Full Specs
768 Shaders 907MHz | 192 Shaders 1.4GHz |
4GB GDDR594.4GB/s placeholder | Shared Memory76.8GB/s · |
·· 1.39 TFLOPS | ·· 537.6 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 35W | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 1.39 TFLOPSFP16 | Peak OPS 1.07 TFLOPSFP16 |
FP32 1.39 TFLOPS | FP32 537.6 GFLOPS |
FP64 87.07 GFLOPS | FP64 134.4 GFLOPS |
Pixel Rate 14.5 GPixel/s | Pixel Rate 11.2 GPixel/s |
Texture Rate 43.5 GTexel/s | Texture Rate 16.8 GTexel/s |
Shaders 768 Shaders | Shaders 192 Shaders |
TMUs 48 TMUs | TMUs 12 TMUs |
ROPs 16 ROPs | ROPs 8 ROPs |
CUs 12 CUs | EUs 24 EUs |
Boost Clock 907MHz | Boost Clock 1.4GHz |
L1 16KB/CU | L1 - |
L2 Cache 1MB shared | L2 Cache - |
4GB GDDR5 placeholder | Shared Memory · |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 5.9GT/s | Memory Speed 4.8GT/s |
Memory Bandwidth 94.4GB/s | Memory Bandwidth 76.8GB/s |
ECC No | ECC No |
TDP 35W | TDP Shared |
Max Resolution 5120x2880 | Max Resolution 7680x4320 |
Refresh Rate Calculator 5120x2880 Resolution5K Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 3 | Multi-Monitor 3 |
Adaptive Sync FreeSync | Adaptive Sync - |
DSC Not Supported | DSC Supported |
HDCP HDCP 2.2 | HDCP - |
Shader Model 6.7 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_0 | DirectX DirectX 12Direct3D 12_1 |
OpenGL 4.6OpenCL 2.1Vulkan 1.3 | OpenGL 4.6OpenCL 3Vulkan 1.2 |
GFX 8 | - |
Encoder VCE 3.4 | Encoder Quick Sync Video 7 |
Codec - - AVC (H.264) HEVC (H.265) | Codec JPEG VP9 AVC (H.264) HEVC (H.265) |
Decoder UVD 6.3 | Decoder Quick Sync Video 7 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - - AVC (H.264) HEVC (H.265) | Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) |
Form Factor Soldered | Form Factor iGPU |
PCIe PCIe 3.0 x8 | PCIe - |
Cooling Open-Air | Cooling Passive |
Multi-GPU Multi-GPU Support SupportedMulti-GPU Type CrossFire XDMA | Multi-GPU - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Baffin | Codename Xe LP |
Chip Variant Polaris 21 XL | Chip Variant GT1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Jul 16, 2018 | Release Date Jan 18, 2022 |
Foundry GlobalFoundries | Foundry Intel |
Fabrication Node 14LPP | Fabrication Node Intel 7 |
Die Size 123mm² | Die Size 158mm² |
Transistor Count 3B | Transistor Count 11.4B |
Transistor Density 24.39 MTr/mm² | Transistor Density 72 MTr/mm² |

