Apple Radeon Pro 555X vs Intel UHD 750 1200MHz Full Specs
768 Shaders 907MHz | 256 Shaders 1.2GHz |
4GB GDDR594.4GB/s placeholder | Shared Memory51.2GB/sDDR4 |
·· 1.39 TFLOPS | ·· 614.4 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 35W | TDP Shared |
Radeon Pro 555X1.39 TFLOPSFP16
UHD 750 1200MHz1.23 TFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 1.39 TFLOPSFP16 | Peak OPS 1.23 TFLOPSFP16 |
FP32 1.39 TFLOPS | FP32 614.4 GFLOPS |
FP64 87.07 GFLOPS | FP64 153.6 GFLOPS |
Pixel Rate 14.5 GPixel/s | Pixel Rate 9.6 GPixel/s |
Texture Rate 43.5 GTexel/s | Texture Rate 19.2 GTexel/s |
Shaders 768 Shaders | Shaders 256 Shaders |
TMUs 48 TMUs | TMUs 16 TMUs |
ROPs 16 ROPs | ROPs 8 ROPs |
CUs 12 CUs | EUs 32 EUs |
Boost Clock 907MHz | Boost Clock 1.2GHz |
L2 Cache 1MB shared | L2 Cache - |
4GB GDDR5 placeholder | Shared MemoryDDR4 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 5.9GT/s | Memory Speed 3.2GT/s |
Memory Bandwidth 94.4GB/s | Memory Bandwidth 51.2GB/s |
ECC No | ECC No |
TDP 35W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP - |
Encoder Model VCE 3.4 | Encoder Model Quick Sync Video 7 |
Decoder Model UVD 6.3 | Decoder Model Quick Sync Video 7 |
Form Factor Soldered | Form Factor iGPU |
Cooling Open-Air | Cooling Passive |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Baffin | Codename Xe LP |
Chip Variant Polaris 21 XL | Chip Variant GT1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Jul 16, 2018 | Release Date Mar 16, 2021 |
Foundry GlobalFoundries | Foundry Intel |
Fabrication Node 14LPP | Fabrication Node 14nm++++ |
Die Size 123mm² | Die Size 276mm² |
Transistor Count 3 Billion | Transistor Count 6.9 Billion |
Transistor Density 24.39 MTr/mm² | Transistor Density 25 MTr/mm² |
No images available
No images available
CPUs - | CPUs |
Laptops | Laptops - |
All-in-Ones | All-in-Ones |