GPUs

Apple Radeon Pro 560X vs NVIDIA GeForce RTX 2080 Full Specs

1,024 Shaders
1GHz
2,944 Shaders
1.71GHz
4GB GDDR594.4GB/s
8GB GDDR6448GB/s
··
2.06 TFLOPS
··
10.07 TFLOPS
Form Factor
Soldered
Form Factor
PCIe Card
TDP
35W
TDP
215W
Power Connectors
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon Pro 560XRadeon Pro 560X2.06 TFLOPSFP16
x1
GeForce RTX 2080GeForce RTX 2080322.2 TOPSINT4 Tensor
x156.69

Clock Speed
··
Clock Speed
···
Peak OPS
2.06 TFLOPSFP16
Peak OPS
322.2 TOPSINT4 Tensor
-
Tensor FP16-16
80.55 TFLOPS
Tensor FP16-32
40.27 TFLOPS
-
Tensor BF16
40.27 TFLOPS
Tensor TF32
-
Tensor TF32
40.27 TFLOPS
FP32
2.06 TFLOPS
FP32
10.07 TFLOPS
FP64
128.5 GFLOPS
FP64
314.6 GFLOPS
Tensor INT4
-
Tensor INT4
322.2 TOPS
-
Tensor INT8
161.1 TOPS
Ray
-
Ray
30.37 TOPS
Pixel Rate
16.1 GPixel/s
Pixel Rate
109.4 GPixel/s
Texture Rate
64.3 GTexel/s
Texture Rate
314.6 GTexel/s

Shaders
1,024 Shaders
Shaders
2,944 Shaders
TMUs
64 TMUs
TMUs
184 TMUs
ROPs
16 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
368 T-Cores
RT Cores
-
RT Cores
46 RT-Cores
CUs
16 CUs
SMs
46 SMs

Base Clock
-
Base Clock
1.51GHz
Boost Clock
1GHz
Boost Clock
1.71GHz

L2 Cache
1MB shared
L2 Cache
4.1MB shared

4GB GDDR5
8GB GDDR6
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
5.9GT/s
Memory Speed
14GT/s
Memory Bandwidth
94.4GB/s
Memory Bandwidth
448GB/s

TDP
35W
TDP
215W
Max Temp
-
Max Temp
88°C Max

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
HDCP 2.2

-
3x DisplayPort 1.4
-
1x HDMI 2.0
-
1x USB-C

Encoder Model
VCE 3.4
Encoder Model
NVENC 7

Decoder Model
UVD 6.3
Decoder Model
NVDEC 4

Form Factor
Soldered
Form Factor
PCIe Card
PCIe
-
PCIe
2-Slots
-
Height
115.7 mm (4.55")
Width
266.7 mm (10.5")
Depth
35 mm (1.38")
Cooling
Open-Air
-
Cooling
Open-Air
2x Fans
Power Connectors
-
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2016 branding
Branding
GeForce RTX 2018 branding
Codename
Baffin
Codename
NV164
Chip Variant
Polaris 21 XL
Chip Variant
TU104-150-KC-A1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jul 16, 2018
Release Date
Sep 20, 2018

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
12FFN
Die Size
123mm²
Die Size
545mm²
Transistor Count
3 Billion
Transistor Count
13.6 Billion
Transistor Density
24.39 MTr/mm²
Transistor Density
24.95 MTr/mm²

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