Apple Radeon Pro 570X vs Intel UHD 750 1200MHz Full Specs
1,792 Shaders 1.1GHz | 256 Shaders 1.2GHz |
4GB GDDR5217.6GB/s placeholder | Shared Memory51.2GB/sDDR4 |
·· 3.96 TFLOPS | ·· 614.4 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 95W | TDP Shared |
Radeon Pro 570X3.96 TFLOPSFP16
UHD 750 1200MHz1.23 TFLOPSFP16Clock Speed ··· | Clock Speed ·· |
Peak OPS 3.96 TFLOPSFP16 | Peak OPS 1.23 TFLOPSFP16 |
FP32 3.96 TFLOPS | FP32 614.4 GFLOPS |
FP64 247.5 GFLOPS | FP64 153.6 GFLOPS |
Pixel Rate 35.4 GPixel/s | Pixel Rate 9.6 GPixel/s |
Texture Rate 123.8 GTexel/s | Texture Rate 19.2 GTexel/s |
Shaders 1,792 Shaders | Shaders 256 Shaders |
TMUs 112 TMUs | TMUs 16 TMUs |
ROPs 32 ROPs | ROPs 8 ROPs |
CUs 28 CUs | EUs 32 EUs |
Base Clock 1GHz | Base Clock - |
Boost Clock 1.1GHz | Boost Clock 1.2GHz |
L2 Cache 2MB shared | L2 Cache - |
4GB GDDR5 placeholder | Shared MemoryDDR4 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 6.8GT/s | Memory Speed 3.2GT/s |
Memory Bandwidth 217.6GB/s | Memory Bandwidth 51.2GB/s |
ECC No | ECC No |
TDP 95W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP - |
Encoder Model VCE 3.0 | Encoder Model Quick Sync Video 7 |
Decoder Model UVD 6.3 | Decoder Model Quick Sync Video 7 |
Form Factor Soldered | Form Factor iGPU |
Cooling Open-Air | Cooling Passive |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Ellesmere | Codename Xe LP |
Chip Variant Polaris 20 XL | Chip Variant GT1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Mar 18, 2019 | Release Date Mar 16, 2021 |
Foundry GlobalFoundries | Foundry Intel |
Fabrication Node 14LPP | Fabrication Node 14nm++++ |
Die Size 232mm² | Die Size 276mm² |
Transistor Count 5.7 Billion | Transistor Count 6.9 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 25 MTr/mm² |
No images available
No images available
CPUs - | CPUs |
All-in-Ones | All-in-Ones |