GPUs

Apple Radeon Pro 575 vs MSI GeForce RTX 3080 12GB Ventus 3X Plus OC Full Specs

2,048 Shaders
1.1GHz
8,960 Shaders
1.74GHz
4GB GDDR5217.6GB/s
12GB GDDR6X912.4GB/s
··
4.49 TFLOPS
··
31.18 TFLOPS
Form Factor
Soldered
Form Factor
PCIe Card
TDP
115W
TDP
350W
Power Connectors
-
Power Connectors
2x 8-Pin

Clock Speed
··
Clock Speed
···
Peak OPS
4.49 TFLOPSFP16
Peak OPS
997.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
124.7 TFLOPS
FP16-16 Tensor Sparse
249.4 TFLOPS
Tensor FP16-32
62.36 TFLOPS
FP16-32 Tensor Sparse
124.7 TFLOPS
-
BF16
31.18 TFLOPS
Tensor BF16
62.36 TFLOPS
BF16 Tensor Sparse
124.7 TFLOPS
Tensor TF32
-
Tensor TF32
31.18 TFLOPS
FP32
4.49 TFLOPS
FP32
31.18 TFLOPS
FP64
280.6 GFLOPS
FP64
487.2 GFLOPS
Tensor INT4
-
Tensor INT4
498.9 TOPS
-
Tensor INT8
249.4 TOPS
Ray
-
Ray
47.03 TOPS
Pixel Rate
35.1 GPixel/s
Pixel Rate
194.9 GPixel/s
Texture Rate
140.3 GTexel/s
Texture Rate
487.2 GTexel/s

Shaders
2,048 Shaders
Shaders
8,960 Shaders
TMUs
128 TMUs
TMUs
280 TMUs
ROPs
32 ROPs
ROPs
112 ROPs
Tensor Cores
-
Tensor Cores
280 T-Cores
RT Cores
-
RT Cores
70 RT-Cores
CUs
32 CUs
SMs
70 SMs

Base Clock
-
Base Clock
1.26GHz
Boost Clock
1.1GHz
Boost Clock
1.74GHz

L2 Cache
2MB shared
L2 Cache
5MB shared

4GB GDDR5
12GB GDDR6X
Memory Bus
256-bit
Memory Bus
384-bit
Memory Speed
6.8GT/s
Memory Speed
19GT/s
Memory Bandwidth
217.6GB/s
Memory Bandwidth
912.4GB/s
ECC
No
ECC
No

TDP
115W
TDP
350W
Max Temp
-
Max Temp
93°C Max

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
1x HDMI 2.1

Encoder Model
VCE 3.0
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
UVD 6.3
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
-
AVC (H.264)
HEVC (H.265)
-
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
PCIe Card
PCIe
-
PCIe
2.8-Slots
-
Height
120 mm (4.72")
Width
305 mm (12.01")
Depth
57 mm (2.24")
Cooling
Open-Air
-
Cooling
Open-Air
3x Fans
Power Connectors
-
Power Connectors
2x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2016 branding
Branding
GeForce RTX 2018 branding
Codename
Ellesmere
Codename
NV172
Chip Variant
Polaris 20 XL
Chip Variant
GA102-200-KD-A1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jun 6, 2017
Release Date
Jan 27, 2022

Foundry
GlobalFoundries
Foundry
Samsung
Fabrication Node
14LPP
Fabrication Node
8N
Die Size
232mm²
Die Size
628mm²
Transistor Count
5.7 Billion
Transistor Count
28.3 Billion
Transistor Density
24.57 MTr/mm²
Transistor Density
45.04 MTr/mm²