Apple Radeon Pro 575 vs NVIDIA GeForce RTX 2070 Super Max-Q Full Specs

Summary

2,048 Shaders 1.1GHz	2,560 Shaders 1.16GHz
4GB GDDR5217.6GB/s	8GB GDDR6384GB/s
Peak·FP32·FP16 4.49 TFLOPS	Peak·FP32·FP16 5.91 TFLOPS
Form Factor Soldered	Form Factor Soldered
TDP 115W	TDP 80W

Theoretical Performance

Clock Speed1096MHz UC·Boost·OC	Clock Speed1155MHz UC·Base·Boost·OC
Peak OPS 4.49 TFLOPSFP16	Peak OPS 189.2 TOPSINT4 Tensor
-	Tensor FP16-16 47.31 TFLOPS Tensor FP16-32 23.65 TFLOPS
-	Tensor BF16 23.65 TFLOPS
Tensor TF32 -	Tensor TF32 23.65 TFLOPS
FP32 4.49 TFLOPS	FP32 5.91 TFLOPS
FP64 280.6 GFLOPS	FP64 184.8 GFLOPS
Tensor INT4 -	Tensor INT4 189.2 TOPS
-	Tensor INT8 94.62 TOPS
Ray -	Ray 17.84 TOPS
Pixel Rate 35.1 GPixel/s	Pixel Rate 73.9 GPixel/s
Texture Rate 140.3 GTexel/s	Texture Rate 184.8 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 2,560 Shaders
TMUs 128 TMUs	TMUs 160 TMUs
ROPs 32 ROPs	ROPs 64 ROPs
Tensor Cores -	Tensor Cores 320 T-Cores
RT Cores -	RT Cores 40 RT-Cores
CUs 32 CUs	SMs 40 SMs

Clocks

Base Clock -	Base Clock 930MHz
Boost Clock 1.1GHz	Boost Clock 1.16GHz

Cache

L2 Cache 2MB shared

L2 Cache 4MB shared

Memory

4GB GDDR5	8GB GDDR6
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 6.8GT/s	Memory Speed 12GT/s
Memory Bandwidth 217.6GB/s	Memory Bandwidth 384GB/s
ECC No	ECC No

Power & Thermals

TDP 115W

TDP 80W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 2.2	HDCP HDCP 2.2

Encoder

Encoder Model VCE 3.0	Encoder Model NVENC 7
Codec AVC (H.264) HEVC (H.265)	Codec AVC (H.264) HEVC (H.265)

Decoder

Decoder Model UVD 6.3	Decoder Model NVDEC 4
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - - AVC (H.264) HEVC (H.265)	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265)

Card

Form Factor Soldered

Form Factor Soldered

Chip

Manufacturer Apple	Manufacturer NVIDIA
Chip Designer AMD	Chip Designer NVIDIA
Architecture GCN 4	Architecture Turing
Family Radeon Pro	Family GeForce 20
Branding	Branding
Codename Ellesmere	Codename NV164
Chip Variant Polaris 20 XL	Chip Variant TU104-150-KC-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jun 6, 2017	Release Date Apr 2, 2020

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node 12FFN
Die Size 232mm²	Die Size 545mm²
Transistor Count 5.7 Billion	Transistor Count 13.6 Billion
Transistor Density 24.57 MTr/mm²	Transistor Density 24.95 MTr/mm²

Images