Apple Radeon Pro 575 vs ZOTAC GeForce RTX 3070 Ti AMP Holo Full Specs
2,048 Shaders 1.1GHz | 6,144 Shaders 1.83GHz |
4GB GDDR5217.6GB/s | 8GB GDDR6X608.3GB/s |
·· 4.49 TFLOPS | ·· 22.49 TFLOPS |
Form Factor Soldered | Form Factor PCIe Card |
TDP 115W | TDP 310W |
Power Connectors - | Power Connectors 2x 8-Pin |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 4.49 TFLOPSFP16 | Peak OPS 719.6 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 89.95 TFLOPSFP16-16 Tensor Sparse 179.9 TFLOPSTensor FP16-32 44.97 TFLOPSFP16-32 Tensor Sparse 89.95 TFLOPS |
- | BF16 22.49 TFLOPSTensor BF16 44.97 TFLOPSBF16 Tensor Sparse 89.95 TFLOPS |
Tensor TF32 - | Tensor TF32 22.49 TFLOPS |
FP32 4.49 TFLOPS | FP32 22.49 TFLOPS |
FP64 280.6 GFLOPS | FP64 351.4 GFLOPS |
Tensor INT4 - | Tensor INT4 359.8 TOPS |
- | Tensor INT8 179.9 TOPS |
Ray - | Ray 33.92 TOPS |
Pixel Rate 35.1 GPixel/s | Pixel Rate 175.7 GPixel/s |
Texture Rate 140.3 GTexel/s | Texture Rate 351.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 6,144 Shaders |
TMUs 128 TMUs | TMUs 192 TMUs |
ROPs 32 ROPs | ROPs 96 ROPs |
Tensor Cores - | Tensor Cores 192 T-Cores |
RT Cores - | RT Cores 48 RT-Cores |
CUs 32 CUs | SMs 48 SMs |
Base Clock - | Base Clock 1.57GHz |
Boost Clock 1.1GHz | Boost Clock 1.83GHz |
L2 Cache 2MB shared | L2 Cache 4.1MB shared |
4GB GDDR5 | 8GB GDDR6X |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 6.8GT/s | Memory Speed 19GT/s |
Memory Bandwidth 217.6GB/s | Memory Bandwidth 608.3GB/s |
TDP 115W | TDP 310W |
Max Temp - | Max Temp 93°C Max |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor PCIe Card |
PCIe - | PCIe 3.2-Slots |
- | Height 131.8 mm (5.19")Width 317.8 mm (12.51")Depth 64.6 mm (2.54") |
Cooling Open-Air - | Cooling Open-Air 3x Fans |
Power Connectors - | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV174 |
Chip Variant Polaris 20 XL | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Jun 6, 2017 | Release Date Jun 10, 2021 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 393mm² |
Transistor Count 5.7 Billion | Transistor Count 17.4 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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All-in-Ones | All-in-Ones - |



