Apple Radeon Pro 575X vs NVIDIA GeForce RTX 5070 Laptop 80W Full Specs
2,048 Shaders 1.1GHz | 4,608 Shaders 2.1GHz |
4GB GDDR5217.6GB/s | 8GB GDDR7448GB/s |
·· 4.49 TFLOPS | ·· 19.33 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 115W | TDP 80W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 4.49 TFLOPSFP16 | Peak OPS 753.5 TFLOPSFP4 Tensor Sparse |
- | Tensor FP4 376.8 TFLOPSFP4 Tensor Sparse 753.5 TFLOPS |
- | Tensor FP8-16 188.4 TFLOPSFP8-16 Tensor Sparse 376.8 TFLOPSTensor FP8-32 94.19 TFLOPSFP8-32 Tensor Sparse 188.4 TFLOPS |
- | Tensor FP16-16 94.19 TFLOPSFP16-16 Tensor Sparse 188.4 TFLOPSTensor FP16-32 47.09 TFLOPSFP16-32 Tensor Sparse 94.19 TFLOPS |
- | BF16 19.33 TFLOPSTensor BF16 47.09 TFLOPSBF16 Tensor Sparse 94.19 TFLOPS |
Tensor TF32 - | Tensor TF32 23.55 TFLOPS |
FP32 4.49 TFLOPS | FP32 19.33 TFLOPS |
FP64 280.6 GFLOPS | FP64 302 GFLOPS |
- | Tensor INT8 188.4 TOPS |
Ray - | Ray 58.61 TOPS |
Pixel Rate 35.1 GPixel/s | Pixel Rate 100.7 GPixel/s |
Texture Rate 140.3 GTexel/s | Texture Rate 302 GTexel/s |
Shaders 2,048 Shaders | Shaders 4,608 Shaders |
TMUs 128 TMUs | TMUs 144 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 144 T-Cores |
RT Cores - | RT Cores 36 RT-Cores |
CUs 32 CUs | SMs 36 SMs |
Base Clock - | Base Clock 1.6GHz |
Boost Clock 1.1GHz | Boost Clock 2.1GHz |
Tensor Clock - | Tensor Clock 2.56GHz |
L2 Cache 2MB shared | L2 Cache 32.8MB shared |
4GB GDDR5 | 8GB GDDR7 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 6.8GT/s | Memory Speed 28GT/s |
Memory Bandwidth 217.6GB/s | Memory Bandwidth 448GB/s |
ECC No | ECC No |
TDP 115W | TDP 80W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
Encoder Model VCE 3.0 | Encoder Model NVENC 9 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 6 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV196 |
Chip Variant Polaris 20 XL | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date Mar 18, 2019 | Release Date Jan 6, 2025 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node 4NP |
Die Size 232mm² | Die Size 183mm² |
Transistor Count 5.7 Billion | Transistor Count 23 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 125.7 MTr/mm² |
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All-in-Ones | All-in-Ones - |



