Apple Radeon Pro 580X MPX vs Qualcomm Adreno X2-90 7T Full Specs

Summary

2,304 Shaders 1.22GHz	2,048 Shaders 1.7GHz
8GB GDDR5218.9GB/s placeholder	Shared Memory152.4GB/sLPDDR5X
Peak·FP32·FP16 5.62 TFLOPS	Peak·FP32·FP16 6.96 TFLOPS
Form Factor MPX	Form Factor iGPU
TDP 185W	TDP 15W

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 BF16 Memory Bandwidth TDP

Radeon Pro 580X MPX5.62 TFLOPSFP16

x1

Adreno X2-90 7T13.93 TFLOPSFP16

x2.48

Show Top Score

Theoretical Performance

Clock Speed1220MHz UC·Base·Boost·OC	Clock Speed1700MHz UC·Boost·OC
Peak OPS 5.62 TFLOPSFP16	Peak OPS 13.93 TFLOPSFP16
-	BF16 13.93 TFLOPS
FP32 5.62 TFLOPS	FP32 6.96 TFLOPS
FP64 351.4 GFLOPS	FP64 1.74 TFLOPS
Pixel Rate 39 GPixel/s	Pixel Rate 108.8 GPixel/s
Texture Rate 175.7 GTexel/s	Texture Rate 217.6 GTexel/s

Core Config

Shaders 2,304 Shaders	Shaders 2,048 Shaders
TMUs 144 TMUs	TMUs 128 TMUs
ROPs 32 ROPs	ROPs 64 ROPs
CUs 36 CUs	EUs 16 EUs

Clocks

Base Clock 1.1GHz	Base Clock -
Boost Clock 1.22GHz	Boost Clock 1.7GHz

Cache

L2 Cache 2MB shared	L2 Cache 2MB shared
L3 Cache -	L3 Cache 21MB shared

Memory

8GB GDDR5 placeholder	Shared MemoryLPDDR5X
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 6.8GT/s	Memory Speed 9.5GT/s
Memory Bandwidth 218.9GB/s	Memory Bandwidth 152.4GB/s
ECC No	ECC No

Power & Thermals

TDP 185W	TDP 15W
Max Temp 100°C Max	Max Temp -

Video Output

Multi-Monitor 6	Multi-Monitor 3
HDCP HDCP 2.2	HDCP -

Ports

2x HDMI 2.0

-

Encoder

Encoder Model VCE 3.4

Encoder Model Hexagon AV1

Decoder

Decoder Model UVD 6.3

Decoder Model Hexagon AV1

Card

Form Factor MPX	Form Factor iGPU
PCIe 2-Slots	PCIe -
Cooling Passive	Cooling Open-Air

Chip

Manufacturer Apple	Manufacturer Qualcomm
Chip Designer AMD	Chip Designer Qualcomm
Architecture GCN 4	Architecture Adreno X
Family Radeon Pro	Family Adreno X
Branding	Branding
Codename Ellesmere	Codename -
Chip Variant Polaris 20 XL	Chip Variant -
Market Segment Workstation	Market Segment Laptop
Release Date Dec 11, 2019	Release Date Sep 24, 2025

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N3E
Die Size 232mm²	Die Size 288mm²
Transistor Count 5.7 Billion	Transistor Count -
Transistor Density 24.57 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

CPUs -	CPUs Snapdragon X2 Elite (X2E-88-100)
Desktops Mac Pro(Late 2019)	Desktops -

Competitors

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