Apple Radeon Pro 580X vs ASUS GeForce RTX 3070 Ti TUF OC Full Specs
2,304 Shaders 1.2GHz | 6,144 Shaders 1.81GHz |
8GB GDDR5217.6GB/s | 8GB GDDR6X608.3GB/s |
·· 5.53 TFLOPS | ·· 22.3 TFLOPS |
Form Factor Soldered | Form Factor PCIe Card |
TDP 125W | TDP 290W |
Power Connectors - | Power Connectors 2x 8-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 5.53 TFLOPSFP16 | Peak OPS 713.7 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 89.21 TFLOPSFP16-16 Tensor Sparse 178.4 TFLOPSTensor FP16-32 44.61 TFLOPSFP16-32 Tensor Sparse 89.21 TFLOPS |
- | BF16 22.3 TFLOPSTensor BF16 44.61 TFLOPSBF16 Tensor Sparse 89.21 TFLOPS |
Tensor TF32 - | Tensor TF32 22.3 TFLOPS |
FP32 5.53 TFLOPS | FP32 22.3 TFLOPS |
FP64 345.6 GFLOPS | FP64 348.5 GFLOPS |
Tensor INT4 - | Tensor INT4 356.8 TOPS |
- | Tensor INT8 178.4 TOPS |
Ray - | Ray 33.64 TOPS |
Pixel Rate 38.4 GPixel/s | Pixel Rate 174.2 GPixel/s |
Texture Rate 172.8 GTexel/s | Texture Rate 348.5 GTexel/s |
Shaders 2,304 Shaders | Shaders 6,144 Shaders |
TMUs 144 TMUs | TMUs 192 TMUs |
ROPs 32 ROPs | ROPs 96 ROPs |
Tensor Cores - | Tensor Cores 192 T-Cores |
RT Cores - | RT Cores 48 RT-Cores |
CUs 36 CUs | SMs 48 SMs |
Base Clock 1.1GHz | Base Clock 1.57GHz |
Boost Clock 1.2GHz | Boost Clock 1.81GHz |
L2 Cache 2MB shared | L2 Cache 4.1MB shared |
8GB GDDR5 | 8GB GDDR6X |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 6.8GT/s | Memory Speed 19GT/s |
Memory Bandwidth 217.6GB/s | Memory Bandwidth 608.3GB/s |
ECC No | ECC No |
TDP 125W | TDP 290W |
Max Temp - | Max Temp 93°C Max |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
- | 2x HDMI 2.1 |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor PCIe Card |
PCIe - | PCIe 2.5-Slots |
- | Height 126.9 mm (5")Width 299.9 mm (11.81")Depth 51.7 mm (2.04") |
Cooling Open-Air - | Cooling Open-Air 3x Fans |
Power Connectors - | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV174 |
Chip Variant Polaris 20 XL | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Mar 18, 2019 | Release Date Jun 10, 2021 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 393mm² |
Transistor Count 5.7 Billion | Transistor Count 17.4 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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All-in-Ones | All-in-Ones - |



