Apple Radeon Pro Vega II Duo vs Intel Arc A770 16GB Full Specs

Summary

8,192 Shaders 1.72GHz	4,096 Shaders 2.4GHz
64GB HBM22.05TB/s	16GB GDDR6560.1GB/s
Peak·FP32·FP16 28.18 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor MPX	Form Factor PCIe Card
TDP 475W	TDP 225W

Theoretical Performance

Clock Speed1720MHz UC·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 56.36 TFLOPSFP16	Peak OPS 629.1 TOPSINT4 Tensor
-	Tensor FP16-32 157.3 TFLOPS
-	Tensor BF16 157.3 TFLOPS
FP32 28.18 TFLOPS	FP32 19.66 TFLOPS
FP64 7.04 TFLOPS	FP64 4.92 TFLOPS
Tensor INT4 -	Tensor INT4 629.1 TOPS
-	Tensor INT8 314.6 TOPS
Pixel Rate 110.1 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 440.3 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 8,192 Shaders	Shaders 4,096 Shaders
TMUs 512 TMUs	TMUs 256 TMUs
ROPs 128 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 128 CUs	EUs 512 EUs

Clocks

Base Clock -	Base Clock 2.1GHz
Boost Clock 1.72GHz	Boost Clock 2.4GHz

Cache

L2 Cache 4MB shared

L2 Cache 8MB shared

Memory

64GB HBM2	16GB GDDR6
Memory Bus 4096-bit	Memory Bus 256-bit
Memory Speed 2GT/s	Memory Speed 17.5GT/s
Memory Bandwidth 2.05TB/s	Memory Bandwidth 560.1GB/s
ECC No	ECC No

Power & Thermals

TDP 475W

TDP 225W

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP HDCP 2.2	HDCP -

Ports

- 1x HDMI 2.0 4x Thunderbolt 3

3x DisplayPort 2.0 1x HDMI 2.1 -

Encoder

Encoder Model VCE 4.1	Encoder Model Arc
Codec AVC (H.264) HEVC (H.265) -	Codec AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model UVD 7.2	Decoder Model Arc
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) HEVC (H.265) -	Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor MPX	Form Factor PCIe Card
PCIe 4-Slots	PCIe 2-Slots
-	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Passive -	Cooling Open-Air 2x Fans

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 5	Architecture Alchemist
Family Radeon Pro Vega	Family Arc A
Branding	Branding
Codename Moonshot	Codename Xe HPG
Chip Variant Vega 20 XT	Chip Variant DG2-512
Market Segment Workstation	Market Segment Desktop
Release Date Dec 1, 2019	Release Date Oct 14, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N7	Fabrication Node N6
Die Size 331mm²	Die Size 406mm²
Transistor Count 13.2 Billion	Transistor Count 21.7 Billion
Transistor Density 39.97 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images