Apple Radeon Pro Vega II vs Intel Arc A770M Full Specs
4,096 Shaders 1.72GHz | 4,096 Shaders 1.65GHz |
32GB HBM21.02TB/s | 16GB GDDR6512GB/s |
·· 14.09 TFLOPS | ·· 13.52 TFLOPS |
Form Factor MPX | Form Factor Soldered |
TDP 300W | TDP 120W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 28.18 TFLOPSFP16 | Peak OPS 432.5 TOPSINT4 Tensor |
- | Tensor FP16-32 108.1 TFLOPS |
- | Tensor BF16 108.1 TFLOPS |
FP32 14.09 TFLOPS | FP32 13.52 TFLOPS |
FP64 3.52 TFLOPS | FP64 3.38 TFLOPS |
Tensor INT4 - | Tensor INT4 432.5 TOPS |
- | Tensor INT8 216.3 TOPS |
Pixel Rate 110.1 GPixel/s | Pixel Rate 211.2 GPixel/s |
Texture Rate 440.3 GTexel/s | Texture Rate 422.4 GTexel/s |
Shaders 4,096 Shaders | Shaders 4,096 Shaders |
TMUs 256 TMUs | TMUs 256 TMUs |
ROPs 64 ROPs | ROPs 128 ROPs |
Tensor Cores - | Tensor Cores 512 T-Cores |
RT Cores - | RT Cores 32 RT-Cores |
CUs 64 CUs | EUs 512 EUs |
Base Clock - | Base Clock 300MHz |
Boost Clock 1.72GHz | Boost Clock 1.65GHz |
L2 Cache 4MB shared | L2 Cache 8MB shared |
32GB HBM2 | 16GB GDDR6 |
Memory Bus 4096-bit | Memory Bus 256-bit |
Memory Speed 2GT/s | Memory Speed 16GT/s |
Memory Bandwidth 1.02TB/s | Memory Bandwidth 512GB/s |
ECC No | ECC No |
TDP 300W | TDP 120W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP - |
1x HDMI 2.0 4x Thunderbolt 3 | - |
Encoder Model VCE 4.1 | Encoder Model Arc |
Codec AVC (H.264) HEVC (H.265) - | Codec AVC (H.264) HEVC (H.265) AV1 |
Decoder Model UVD 7.2 | Decoder Model Arc |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) HEVC (H.265) - | Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor MPX | Form Factor Soldered |
PCIe 4-Slots | PCIe - |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Moonshot | Codename Xe HPG |
Chip Variant Vega 20 XT | Chip Variant DG2-512 |
Market Segment Workstation | Market Segment Laptop |
Release Date Dec 1, 2019 | Release Date Jun 28, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N7 | Fabrication Node N6 |
Die Size 331mm² | Die Size 406mm² |
Transistor Count 13.2 Billion | Transistor Count 21.7 Billion |
Transistor Density 39.97 MTr/mm² | Transistor Density 53.45 MTr/mm² |

