ARM Mali-G72 MP18 572MHz vs Imagination IMG DXT-48-1536 1100MHz Full Specs
216 Shaders 572MHz | 768 Shaders 1.1GHz |
Shared Memory29.9GB/sLPDDR4X | Shared Memory68.3GB/sLPDDR5X |
·· 247.1 GFLOPS | ·· 1.69 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Mali-G72 MP18 572MHz494.2 GFLOPSFP16
IMG DXT-48-1536 1100MHz3.38 TFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 494.2 GFLOPSFP16 | Peak OPS 3.38 TFLOPSFP16 |
FP32 247.1 GFLOPS | FP32 1.69 TFLOPS |
Pixel Rate 10.3 GPixel/s | Pixel Rate 52.8 GPixel/s |
Texture Rate 10.3 GTexel/s | Texture Rate 105.6 GTexel/s |
Shaders 216 Shaders | Shaders 768 Shaders |
TMUs 18 TMUs | TMUs 96 TMUs |
ROPs 18 ROPs | ROPs 48 ROPs |
EUs 54 EUs | EUs 48 EUs |
Boost Clock 572MHz | Boost Clock 1.1GHz |
Shared MemoryLPDDR4X | Shared MemoryLPDDR5X |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 3.7GT/s | Memory Speed 8.5GT/s |
Memory Bandwidth 29.9GB/s | Memory Bandwidth 68.3GB/s |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename - | Codename IMG D-Series |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Jan 1, 2018 | Release Date Aug 1, 2025 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 10LPP | Fabrication Node N3E |
Die Size 119mm² | Die Size - |
No images available
No images available
CPUs | CPUs |
Smartphones - | Smartphones |