GPUs

ATI FirePro 3D V7800 vs AMD Radeon PRO W7700 Full Specs

1,440 Shaders
700MHz
3,072 Shaders
2.6GHz
2GB GDDR5128GB/s
16GB GDDR6576GB/s
··
2.02 TFLOPS
··
31.95 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
138W
TDP
190W
Power Connectors
-
1x 6-Pin
Power Connectors
1x 8-Pin
-

FirePro 3D V7800FirePro 3D V78002.02 TFLOPSFP32
x1
Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x63.39

Clock Speed
··
Clock Speed
···
Peak OPS
2.02 TFLOPSFP32
Peak OPS
127.8 TOPSINT4 Tensor
-
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
FP32
2.02 TFLOPS
FP32
31.95 TFLOPS
FP64
403.2 GFLOPS
FP64
998.4 GFLOPS
Tensor INT4
-
Tensor INT4
127.8 TOPS
-
Tensor INT8
31.95 TOPS
Pixel Rate
22.4 GPixel/s
Pixel Rate
249.6 GPixel/s
Texture Rate
50.4 GTexel/s
Texture Rate
499.2 GTexel/s

Shaders
1,440 Shaders
Shaders
3,072 Shaders
TMUs
72 TMUs
TMUs
192 TMUs
ROPs
32 ROPs
ROPs
96 ROPs
Tensor Cores
-
Tensor Cores
96 T-Cores
RT Cores
-
RT Cores
48 RT-Cores
CUs
18 CUs
CUs
48 CUs

Base Clock
-
Base Clock
1.9GHz
Boost Clock
700MHz
Boost Clock
2.6GHz

L2 Cache
512KB shared
L2 Cache
6.1MB shared
L3 Cache
-
L3 Cache
64MB shared
L3 Bandwidth
-
L3 Bandwidth
2.33TB/s

2GB GDDR5
16GB GDDR6
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
4GT/s
Memory Speed
18GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
576GB/s

TDP
138W
TDP
190W

Multi-Monitor
3
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
4x DisplayPort 2.1
2x DisplayPort 1.1
-
1x DVI-I Dual-Link
-

-
Encoder Model
VCN 4.0

Decoder Model
UVD 2.2
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
254 mm (10")
Depth
20 mm (0.79")
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
1x 6-Pin
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro branding
Branding
Radeon Pro 2023 branding
Codename
Cypress
Codename
Wheat Nas
Chip Variant
Cypress LE
Chip Variant
Navi 32
Market Segment
Workstation
Market Segment
Workstation
Release Date
Apr 26, 2010
Release Date
Nov 13, 2023

Foundry
TSMC
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCMCD
Fabrication Node
40nm
-
Fabrication Node
N5
N6MCD
Die Size
334mm²
-
Die Size
200mm²
150mm²MCD
Transistor Count
2.2 Billion
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Density
6.45 MTr/mm²
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD

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