ATI Mobility Radeon HD 3850 vs Qualcomm Adreno 722 Full Specs
320 Shaders 580MHz | 512 Shaders 450MHz |
524MB GDDR3 placeholder | Shared Memory33.6GB/sLPDDR5X |
·· 371.2 GFLOPS | ·· 460.8 GFLOPS |
Form Factor MXM-II | Form Factor iGPU |
TDP 30W | TDP 5W |
Mobility Radeon HD 3850371.2 GFLOPSFP32
Adreno 722921.6 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 371.2 GFLOPSFP32 | Peak OPS 921.6 GFLOPSFP16 |
FP32 371.2 GFLOPS | FP32 460.8 GFLOPS |
FP64 74.24 GFLOPS | FP64 115.2 GFLOPS |
Pixel Rate 9.3 GPixel/s | Pixel Rate 7.2 GPixel/s |
Texture Rate 9.3 GTexel/s | Texture Rate 14.4 GTexel/s |
Shaders 320 Shaders | Shaders 512 Shaders |
TMUs 16 TMUs | TMUs 32 TMUs |
ROPs 16 ROPs | ROPs 16 ROPs |
CUs 4 CUs | EUs 4 EUs |
Boost Clock 580MHz | Boost Clock 450MHz |
L2 Cache 256KB shared | L2 Cache - |
524MB GDDR3 placeholder | Shared MemoryLPDDR5X |
Memory Bus - | Memory Bus 32-bit |
Memory Speed 1.5GT/s | Memory Speed 8.4GT/s |
Memory Bandwidth - | Memory Bandwidth 33.6GB/s |
TDP 30W | TDP 5W |
Multi-Monitor 2 | Multi-Monitor 1 |
- | Encoder Model Hexagon |
Decoder Model UVD 1.0 | Decoder Model Hexagon |
Form Factor MXM-II | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Boom | Codename - |
Chip Variant RV670 Pro | Chip Variant - |
Market Segment Laptop | Market Segment Smartphone |
Release Date Jun 4, 2008 | Release Date May 15, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node N6 |
Die Size 192mm² | Die Size - |
Transistor Count 666 Million | Transistor Count - |
Transistor Density 3.47 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs - | CPUs |