GPUs

ATI Mobility Radeon HD 3850 vs Intel Graphics 2C 2300MHz Full Specs

320 Shaders
580MHz
256 Shaders
2.3GHz
524MB GDDR3
Shared Memory119.5GB/s
·
··
371.2 GFLOPS
··
1.18 TFLOPS
Form Factor
MXM-II
Form Factor
iGPU
TDP
30W
TDP
Shared

Mobility Radeon HD 3850Mobility Radeon HD 3850371.2 GFLOPSFP32
x1
Graphics 2C 2300MHzGraphics 2C 2300MHz37.68 TOPSINT4 Tensor
x101.52

Clock Speed
··
Clock Speed
··
Peak OPS
371.2 GFLOPSFP32
Peak OPS
37.68 TOPSINT4 Tensor
-
Tensor FP16-32
9.42 TFLOPS
-
Tensor BF16
9.42 TFLOPS
FP32
371.2 GFLOPS
FP32
1.18 TFLOPS
FP64
74.24 GFLOPS
FP64
294.4 GFLOPS
Tensor INT4
-
Tensor INT4
37.68 TOPS
-
Tensor INT8
18.84 TOPS
Pixel Rate
9.3 GPixel/s
Pixel Rate
18.4 GPixel/s
Texture Rate
9.3 GTexel/s
Texture Rate
36.8 GTexel/s

Shaders
320 Shaders
Shaders
256 Shaders
TMUs
16 TMUs
TMUs
16 TMUs
ROPs
16 ROPs
ROPs
8 ROPs
Tensor Cores
-
Tensor Cores
16 T-Cores
RT Cores
-
RT Cores
2 RT-Cores
CUs
4 CUs
EUs
16 EUs

Boost Clock
580MHz
Boost Clock
2.3GHz

L2 Cache
256KB shared
L2 Cache
4.1MB shared

524MB GDDR3
Shared Memory
·
Memory Bus
-
Memory Bus
128-bit
Memory Speed
1.5GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
-
Memory Bandwidth
119.5GB/s

TDP
30W
TDP
Shared

Multi-Monitor
2
Multi-Monitor
3

-
Encoder Model
Xe Media Engine

Decoder Model
UVD 1.0
Decoder Model
Xe Media Engine

Form Factor
MXM-II
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2007 branding
Branding
Graphics 2024 branding
Codename
Boom
Codename
Xe3 LPG
Chip Variant
RV670 Pro
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 4, 2008
Release Date
Jan 5, 2026

Foundry
TSMC
Foundry
Intel
Fabrication Node
55nm
Fabrication Node
Intel 3
Die Size
192mm²
Die Size
27mm²
Transistor Count
666 Million
Transistor Count
-
Transistor Density
3.47 MTr/mm²
Transistor Density
-

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