ATI Mobility Radeon HD 3850 X2 vs Intel Graphics 2C 2300MHz Full Specs

Summary

640 Shaders 580MHz	256 Shaders 2.3GHz
1048MB GDDR3 placeholder	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 742.4 GFLOPS	Peak·FP32·FP16 1.18 TFLOPS
Form Factor MXM-II	Form Factor iGPU
TDP 55W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Mobility Radeon HD 3850 X2742.4 GFLOPSFP32 (2x 371.2 GFLOPS)

x1

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x50.76

Show Top Score

Theoretical Performance

Clock Speed580MHz UC·Boost·OC	Clock Speed2300MHz UC·Boost·OC
Peak OPS 742.4 GFLOPSFP32	Peak OPS 37.68 TOPSINT4 Tensor
-	Tensor FP16-32 9.42 TFLOPS
-	Tensor BF16 9.42 TFLOPS
FP32 742.4 GFLOPS	FP32 1.18 TFLOPS
FP64 148.5 GFLOPS	FP64 294.4 GFLOPS
Tensor INT4 -	Tensor INT4 37.68 TOPS
-	Tensor INT8 18.84 TOPS
Pixel Rate 9.3 GPixel/s	Pixel Rate 18.4 GPixel/s
Texture Rate 9.3 GTexel/s	Texture Rate 36.8 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 256 Shaders
TMUs 32 TMUs	TMUs 16 TMUs
ROPs 32 ROPs	ROPs 8 ROPs
Tensor Cores -	Tensor Cores 16 T-Cores
RT Cores -	RT Cores 2 RT-Cores
Units -	EUs 16 EUs

Clocks

Boost Clock 580MHz

Boost Clock 2.3GHz

Cache

L2 Cache 256KB shared

L2 Cache 4.1MB shared

Memory

1048MB GDDR3 placeholder	Shared Memory LPDDR5X·DDR5
Memory Bus -	Memory Bus 128-bit
Memory Speed 1.5GT/s	Memory Speed 7.5GT/s
Memory Bandwidth -	Memory Bandwidth 119.5GB/s
ECC No	ECC No

Power & Thermals

TDP 55W

TDP Shared

Video Output

Multi-Monitor 2

Multi-Monitor 3

Encoder

-	Encoder Model Xe Media Engine

Decoder

Decoder Model UVD 1.0

Decoder Model Xe Media Engine

Card

Form Factor MXM-II

Form Factor iGPU

Chip

Manufacturer ATI	Manufacturer Intel
Chip Designer ATI	Chip Designer Intel
Architecture TeraScale 1	Architecture Battlemage
Family Radeon HD 3000	Family Gen 13
Branding	Branding
Codename Boom	Codename Xe3 LPG
Chip Variant R680 XT	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Jun 5, 2008	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node 55nm	Fabrication Node Intel 3
Die Size 192mm²	Die Size 27mm²
Transistor Count 666 Million	Transistor Count -
Transistor Density 3.47 MTr/mm²	Transistor Density -

Images

No images available

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Used In

CPUs -

CPUs Core Ultra 5 322 Core Ultra 5 332

Competitors

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