ATI Mobility Radeon HD 4860 vs Intel Graphics 4C 2300MHz Full Specs
640 Shaders 650MHz | 512 Shaders 2.3GHz |
1GB GDDR564GB/s placeholder | Shared Memory136.5GB/s · |
·· 832 GFLOPS | ·· 2.35 TFLOPS |
Form Factor MXM-A | Form Factor iGPU |
TDP - | TDP Shared |
Mobility Radeon HD 4860832 GFLOPSFP32
Graphics 4C 2300MHz75.37 TOPSINT4 TensorClock Speed ·· | Clock Speed ·· |
Peak OPS 832 GFLOPSFP32 | Peak OPS 75.37 TOPSINT4 Tensor |
- | Tensor FP16-32 18.84 TFLOPS |
- | Tensor BF16 18.84 TFLOPS |
FP32 832 GFLOPS | FP32 2.35 TFLOPS |
FP64 166.4 GFLOPS | FP64 588.8 GFLOPS |
Tensor INT4 - | Tensor INT4 75.37 TOPS |
- | Tensor INT8 37.68 TOPS |
Pixel Rate 10.4 GPixel/s | Pixel Rate 36.8 GPixel/s |
Texture Rate 20.8 GTexel/s | Texture Rate 73.6 GTexel/s |
Shaders 640 Shaders | Shaders 512 Shaders |
TMUs 32 TMUs | TMUs 32 TMUs |
ROPs 16 ROPs | ROPs 16 ROPs |
Tensor Cores - | Tensor Cores 32 T-Cores |
RT Cores - | RT Cores 4 RT-Cores |
CUs 8 CUs | EUs 32 EUs |
Boost Clock 650MHz | Boost Clock 2.3GHz |
L2 Cache 256KB shared | L2 Cache 4.1MB shared |
1GB GDDR5 placeholder | Shared Memory · |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 4GT/s | Memory Speed 8.5GT/s |
Memory Bandwidth 64GB/s | Memory Bandwidth 136.5GB/s |
ECC No | ECC No |
Multi-Monitor 2 | Multi-Monitor 3 |
- | Encoder Model Xe Media Engine |
Decoder Model UVD 2.0 | Decoder Model Xe Media Engine |
Form Factor MXM-A | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Walden | Codename Xe3 LPG |
Chip Variant RV740 | Chip Variant GT1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Mar 3, 2009 | Release Date Jan 5, 2026 |
Foundry TSMC | Foundry Intel |
Fabrication Node 40nm | Fabrication Node Intel 3 |
Die Size 137mm² | Die Size 27mm² |
Transistor Count 826 Million | Transistor Count - |
Transistor Density 6.03 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs - | CPUs |